Thermally-Enhanced Hybrid LED Package with TSV Carrier
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Solution Overview
Problem
Conventional LED packages using sapphire substrates suffer from inefficient heat dissipation due to low thermal conductivity, which reduces light output and overall efficiency, as heat must be dissipated through long gold wires and occupies valuable chip area.
Innovation Solution
The implementation of a light-emitting device package component that incorporates a carrier chip with through-substrate vias (TSVs) and flip-chip bonding, allowing for efficient heat dissipation through thermal TSVs and dummy solder bumps, while maintaining unobstructed light emission through the transparent substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sapphire substrate is used for LED package, then LED chip can be formed on substrate, but heat dissipation efficiency deteriorates due to low thermal conductivity
Solution Approach 1:
The patent extracts the LED chip from the sapphire substrate and mounts it onto a carrier chip with superior thermal conductivity. This separation allows the LED chip to retain its formation stability on sapphire while the heat dissipation function is transferred to the carrier chip made of high thermal conductivity material.
Solution Approach 2:
The carrier chip serves as an intermediary between the LED chip and the heat sink. It provides a thermal conduction pathway that bridges the gap between the LED chip and the final heat dissipation structure, enabling efficient heat transfer without direct contact between LED and heat sink.
2Reliability
If heat is dissipated through gold wires to lead frame, then electrical connection is achieved, but heat dissipation efficiency deteriorates due to long wire length
Solution Approach 1:
The patent extracts the heat dissipation function from the electrical connection path (gold wires). By providing a separate thermal conduction pathway through the carrier chip and thermal TSVs, heat can be dissipated independently from the electrical connection, eliminating the inefficiency caused by long wire lengths.
3Reliability
If electrode occupies chip area for electrical connection, then electrical connection is achieved, but light output area deteriorates due to reduced active area
Solution Approach 1:
The patent moves the electrical connection function to another dimension by using vertical through-substrate vias (TSVs) in the carrier chip. This allows bond pads to be positioned on the same side as the LED chip, eliminating the need for large electrode areas on the light-emitting surface and maximizing the light output area.
4Ease of manufacture
If conventional LED package structure is used, then manufacturing is simple, but thermal conduction path is inefficient due to low thermal conductivity materials
Solution Approach 1:
The patent employs composite material structure by combining the LED chip on sapphire substrate with a carrier chip made of high thermal conductivity material. This composite approach integrates materials with different properties - sapphire for optical transparency and LED compatibility, and high thermal conductivity material for efficient heat dissipation - creating a structure that optimizes both manufacturing and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances both heat-dissipating and light-emitting efficiency by providing a direct thermal path from the LED chips to a heat sink, eliminating low thermal conductivity materials and optimizing light output area.
Implementation Method 1
The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads
Implementation Method 2
bonded onto the LED chip through flip-chip bonding
Data Source
AI summary
A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads.