TSV-Core Helical Inductors for High Inductance in Small Footprints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in miniaturizing inductors for semiconductor devices is that traditional inductors are bulky, and existing approaches such as active inductors and spiral inductors either consume excessive power or occupy large surface areas, making them cost- and size-prohibitive for high inductance applications.
Innovation Solution
The use of semiconductor devices with through-substrate via cores and substantially helical conductors that extend into the substrate, creating a magnetic field with a high-aspect-ratio TSV and coaxial laminate layers to reduce eddy current losses and increase inductance while minimizing area occupancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional discrete inductors are used, then high inductance is achieved, but the device occupies large area and increases in size
Solution Approach 1:
The patent transitions from planar spiral inductors to three-dimensional inductors utilizing vertical TSV structures. The helical conductor winds around the vertical TSV core, creating a 3D magnetic path that achieves high inductance in a compact footprint by exploiting the vertical dimension rather than expanding horizontally.
Solution Approach 2:
The inductor employs a composite structure combining conductive TSV material (e.g., copper, tungsten) with magnetic material layers (e.g., nickel, cobalt, ferrite) deposited on the TSV surface. This composite configuration enhances magnetic flux confinement and increases effective inductance while maintaining small area occupancy.
2Area of stationary object
If active inductors are used to achieve high inductance, then inductance value increases, but power consumption increases
Solution Approach 1:
The patent replaces active electronic circuits (operational amplifiers, transistors) with a passive electromagnetic structure. The TSV-based inductor achieves high inductance through physical magnetic field generation from current flow, eliminating the need for active components that consume DC bias power, thereby achieving zero static power consumption.
3Reliability
If spiral inductors are used to achieve high inductance, then inductance value increases, but surface area occupancy increases
Solution Approach 1:
The patent transitions from planar spiral inductors to three-dimensional inductors utilizing vertical TSV structures. The helical conductor winds around the vertical TSV core, creating a 3D magnetic path that achieves high inductance in a compact footprint by exploiting the vertical dimension rather than expanding horizontally.
4Area of stationary object
If miniaturization is pursued to reduce area, then area occupancy decreases, but inductance value decreases
Solution Approach 1:
The patent transitions from planar spiral inductors to three-dimensional inductors utilizing vertical TSV structures. The helical conductor winds around the vertical TSV core, creating a 3D magnetic path that achieves high inductance in a compact footprint by exploiting the vertical dimension rather than expanding horizontally.
Solution Approach 2:
The inductor employs a composite structure combining conductive TSV material (e.g., copper, tungsten) with magnetic material layers (e.g., nickel, cobalt, ferrite) deposited on the TSV surface. This composite configuration enhances magnetic flux confinement and increases effective inductance while maintaining small area occupancy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of high-inductance inductors that occupy a small area, reducing power consumption and fabrication costs, while maintaining efficient magnetic field induction and signal/power coupling capabilities.
Implementation Method 1
a substantially helical conductor disposed around the TSV. The substantially helical conductor is configured to induce a magnetic field in the TSV in response to a current passing through the substantially helical conductor
Implementation Method 2
creating a magnetic field with a high-aspect-ratio TSV and coaxial laminate layers to reduce eddy current losses and increase inductance
Data Source
AI summary
A semiconductor device comprising a substrate is provided. The device further comprises a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor disposed around the TSV. The substantially helical conductor can be configured to generate a magnetic field in the TSV in response to a current passing through the helical conductor. More than one TSV can be included, and/or more than one substantially helical conductor can be provided.