Integrated TSV and Fluid Channel Structure for IC Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-power-density semiconductor integrated circuits (ICs) generate significant heat, which air cooling alone may not adequately dissipate, posing challenges for integration into packages or systems while maintaining effective electrical connectivity through TSVs.
Innovation Solution
The implementation of fluid channels for convective cooling beneath heat-generating circuits, alongside vertically oriented TSVs, allows for efficient heat dissipation while preserving space for TSV routing, utilizing etching and substrate bonding techniques to integrate both cooling and electrical connectivity solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If TSVs are routed beneath the circuits to provide electrical connectivity, then electrical connectivity is improved, but heat dissipation is worsened due to space occupation in the material beneath the circuits
Solution Approach 1:
The patent transitions from two-dimensional planar routing to three-dimensional vertical routing by implementing fluid channels that extend through the substrate thickness. This allows cooling channels to pass through the same substrate layer occupied by TSVs without lateral interference, effectively utilizing the vertical dimension to resolve the spatial conflict between electrical connectivity structures and thermal management structures.
Solution Approach 2:
The substrate material serves multiple functions simultaneously: it provides mechanical support for the circuit, accommodates TSVs for electrical connectivity, and contains integrated fluid channels for active cooling. This multi-functional design allows the same substrate to fulfill both electrical and thermal management roles without requiring separate structures.
2Temperature
If fluid channels are implemented for convective cooling beneath circuits, then heat dissipation is improved, but space for TSV routing is reduced
Solution Approach 1:
The patent resolves the spatial conflict by routing fluid channels in the vertical dimension through the substrate thickness, while TSVs are routed laterally in the horizontal plane. This dimensional separation allows both cooling channels and electrical contacts to coexist without interfering with each other's space requirements.
Solution Approach 2:
The design nests multiple functional elements within the substrate structure: TSVs are embedded in the substrate for electrical connectivity, while fluid channels are simultaneously embedded in the same substrate for cooling. Both structures are nested within the substrate material, utilizing different spatial orientations to avoid conflict.
3Device complexity
If air cooling is used for heat dissipation, then device simplicity is maintained, but heat dissipation effectiveness is insufficient for high-power-density ICs
Solution Approach 1:
The patent replaces passive air cooling with active fluid cooling by implementing channels that circulate liquid coolant through the substrate. This hydraulic cooling system provides significantly higher heat transfer coefficients compared to air cooling, effectively addressing the thermal management needs of high-power-density ICs.
Solution Approach 2:
The patent substitutes the simple mechanical convection of air cooling with a more sophisticated fluid circulation system that uses pumped liquid coolant. This replacement provides superior heat dissipation performance for high-power applications, despite the increased system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat transfer efficiency by using fluid convection and maintains high-density TSV routing, effectively addressing the heat dissipation challenges faced by high-power ICs while ensuring reliable electrical connectivity.
Implementation Method 1
The plurality of fluid channels can dissipate heat from a circuit in thermal contact with the first substrate
Implementation Method 2
facilitate movement of a fluid through the plurality of channels to convect (e.g., dissipate via convection) the heat away from the circuit
Implementation Method 3
A second substrate can be bonded to the surface of the first substrate to seal the plurality of fluid channels along the surface of the first substrate
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Technical solutions can provide convective cooling of a heat generating circuit (210) through fluid channels (250) formed beneath the circuit (210) and alongside through substrate vias (TSVs). A plurality of parts of TSVs can be etched perpendicularly inside of a surface of a first substrate, where each of the parts of TSVs can be spaced apart from other parts of the TSVs by a set pitch. A plurality of fluid channels (250) can be etched in the same first substrate, each one of which can be located between one or more of the parts of TSVs. A second substrate (265) including a matching set of parts of TSVs can be bonded to the surface of the first substrate to seal the plurality of fluid channels (250) along the surface of the first substrate and complete the TSVs formation. The plurality of fluid channels (250) can dissipate heat from the circuit (210) in thermal contact with the first substrate.