TSV Interconnect Elevator for Low-NRE FPGA-HBM 3D Packaging

The patent segments the IC design into two parts: a reusable standard cell library (developed once at high NRE cost) and application-specific logic (developed separately at low NRE cost). This allows the expensive advanced technology node to be used for the library, while individual applications can reuse it without bearing the full NRE burden.

The standard cell library serves multiple applications universally. Once created using advanced technology nodes, the same library can be reused across numerous different ASIC or COT designs, amortizing the high NRE cost over many products and making advanced technology accessible to applications with smaller volume demands.

The patent segments the IC design into a reusable standard cell library and application-specific logic. The library is developed once using advanced technology nodes to capture performance benefits, while individual applications can access this performance without repeating the expensive development process.

The standard cell library is created in advance using advanced technology nodes, performing the expensive development work beforehand. This preliminary action allows subsequent applications to benefit from advanced technology performance without incurring the same high NRE costs.

The patent segments the design into a standardized library and application-specific portions. This allows the library to be optimized for manufacturing efficiency while maintaining the ability to adapt to different applications through the configurable logic layers, achieving a balance between adaptability and manufacturing efficiency.

The patent changes the parameter of design reconfigurability by providing a middle ground between fixed ASIC and fully reconfigurable FPGA. The standard cell library provides fixed, optimized structures while allowing application-specific customization, achieving better manufacturing efficiency than FPGA while maintaining some adaptability.