Backside TSV Interconnection Collar Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for post-processing after backside TSV reveal in integrated circuit devices face yield and cost issues, and are not suitable for individual interconnections.
Innovation Solution
A substrate processing method involving a post with a conductor member, where a dielectric collar and a metal collar are formed to facilitate bonding, allowing for improved interconnections by depositing a bonding material on the top surfaces of the conductor, dielectric, and metal collars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conformal dielectric coating is deposited on the surfaces of the substrate and the revealed TSVs followed by planarization and metal layer deposition, then interconnection structure is formed, but yield issues and cost issues occur and individual interconnections are not suitable
Solution Approach 1:
The patent segments the interconnection formation process into individual post-level operations. Instead of applying conformal coating and planarization across the entire substrate, the method forms dielectric collars and metal collars individually around each post, allowing independent processing and inspection of each interconnection structure.
Solution Approach 2:
The patent applies local quality by creating non-uniform dielectric and metal structures around each post. The dielectric collar is formed with varying thickness around the post, and the metal collar is selectively deposited only where needed for bonding, rather than applying uniform layers across the entire substrate surface.
2Ease of manufacture
If conventional conformal coating and planarization is used for backside TSV reveal, then interconnection structure is created, but cost increases and versatility for individual interconnections is reduced
Solution Approach 1:
The patent divides the interconnection structure into discrete, independently processable units. Each post receives its own dielectric collar and metal collar formed through localized deposition processes, enabling individual posts to be processed, inspected, and modified independently of others on the substrate.
Solution Approach 2:
The patent performs preliminary actions by first forming the dielectric collar around each post before depositing the metal collar. This sequential, localized approach allows each interconnection structure to be prepared in advance with precise control over material distribution and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances yield, reduces costs, and increases versatility for individual interconnections by creating a robust bonding structure on the substrate, addressing the limitations of conventional approaches.
Implementation Method 1
A dielectric layer is deposited over the upper surface of the substrate and the upper portion of the post
Implementation Method 2
A conductor layer is deposited over the dielectric layer
Implementation Method 3
A bonding material is deposited onto the top surface of the conductive member and a top surface of each of the dielectric collar and the metal collar
Data Source
AI summary
An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is in contact with a dielectric layer. The dielectric layer is disposed on the upper surface of the substrate and adjacent to the post to provide a dielectric collar for the post. An exterior surface of the dielectric collar is in contact with a conductor layer. The conductor layer is disposed adjacent to the dielectric collar to provide a metal collar for the post, where a top surface of each of the conductor member, the dielectric collar and the metal collar have formed thereon a bond structure for interconnection of the metal collar and the conductor member.