TSV Interposer Edge Reinforcement via Stiffening Material

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Solution Overview

Problem

Conventional TSV interposers are susceptible to damage and cracking during handling due to their thinness, and existing methods to increase stiffness, such as laminating stiffening layers or adding prefabricated rings, complicate the fabrication process and increase manufacturing costs.

Innovation Solution

A TSV interposer with a reinforced edge is fabricated by dispensing a stiffening material in contact with the die underfill material, which provides mechanical reinforcement without adding additional prefabricated components, maintaining a simple and cost-effective manufacturing scheme.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the interposer is made thin to reduce size, then the packaging density is improved, but the interposer becomes susceptible to damage and cracking during handling

Engineering Contradiction:

Improveinterposer sizeVSAvoidinterposer resistance to damage

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent applies local quality by adding stiffening material specifically at the edges of the interposer rather than uniformly throughout. The edge reinforcement consists of a first stiffening material applied to a first edge and a second stiffening material applied to a second edge, providing localized structural support where it is most needed for handling strength while preserving the overall thin profile for packaging density.

Inventive Principle:

Principle #3Local quality

2Strength

If laminated stiffening layers are added to increase interposer stiffness, then the damage resistance is improved, but the material costs and fabrication complexity increase

Engineering Contradiction:

Improveinterposer stiffnessVSAvoidfabrication sequence complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The stiffening material is applied to the edges of the interposer before the die attach process, preparing the structure in advance to withstand subsequent handling and processing steps. This preliminary reinforcement allows the interposer to maintain its thin profile while being sufficiently robust for manufacturing operations.

Inventive Principle:

Principle #10Preliminary action

3Strength

If a prefabricated stiffening ring is bonded on the interposer surface to increase stiffness, then the damage resistance is improved, but the material costs and fabrication complexity increase

Engineering Contradiction:

Improveinterposer stiffnessVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

Instead of using a complete prefabricated stiffening ring around the entire interposer perimeter, the patent applies stiffening material selectively to specific edges (first edge and second edge) where reinforcement is most critical. This localized approach reduces material consumption and simplifies the manufacturing process while maintaining sufficient structural integrity.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS9627329B1Interposer with edge reinforcement and method for manufacturing same

Publication Date: 2017.04.18 XILINX INC

AI summary

A TSV interposer having a reinforced edge and methods for fabricating an IC package utilizing the same are provided. In one embodiment, a chip package includes an interposer having a wiring layer and a die disposed on a surface of the interposer. The die is electrically connected to the wiring layer of the interposer. A die underfill material is disposed between the interposer and the die. The die underfill material at least partially covers a side of the die that extends away from the surface of the interposer. Stiffening material is disposed in contact with the interposer and the die underfill material.