TSV Semiconductor Package Redundancy Pads for Non-Wetting Failures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in maintaining reliable electrical connections and preventing failures such as non-wetting and electrical connection failures, particularly in edge areas where through-silicon vias (TSVs) are formed, leading to potential product reliability issues.
Innovation Solution
The semiconductor package incorporates redundancy pads and bumps that are not in contact with TSVs, ensuring electrical connectivity even if primary connections fail, and uses interconnection lines to connect pads and redundancy pads, enhancing reliability by avoiding direct contact with TSVs and thus preventing non-wetting failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pads are placed in contact with TSVs to ensure electrical connectivity, then electrical connection is achieved, but non-wetting failures and connection failures occur leading to reduced reliability
Solution Approach 1:
The pad structure is segmented into two distinct types: primary pads that contact TSVs for electrical connectivity and redundancy pads that are spaced apart from TSVs to avoid non-wetting failures. This segmentation allows the system to maintain electrical connection while preventing connection failures by distributing functionality across separate pad elements.
Solution Approach 2:
Redundance pads are prepared in advance and electrically connected to primary pads through interconnection lines. This preliminary setup ensures that if primary pads fail due to non-wetting or connection failures, the redundancy pads are already positioned and connected to provide backup electrical connectivity, thus preventing product failure.
2Reliability
If redundancy pads are added to prevent connection failures, then reliability is improved, but device complexity increases
Solution Approach 1:
The redundancy pads are merged with the existing pad structure by electrically connecting them to primary pads through interconnection lines. This integration allows the redundancy function to be added without creating entirely separate structures, thus improving reliability while minimizing the increase in device complexity.
Solution Approach 2:
The interconnection lines serve multiple functions: they electrically connect primary pads to redundancy pads, and provide a pathway for electrical signals. This multi-functionality reduces the need for additional dedicated structures, thereby improving reliability without proportionally increasing device complexity.
Data Source
AI summary
A semiconductor package including a first stack; a plurality of TSVs passing through the first stack; a second stack on the first stack and including a second surface facing a first surface of the first stack; a first pad on the first stack and in contact with the TSVs; a second pad on the second stack; a bump connecting the first and second pads; a first redundancy pad on the first surface of the first stack, spaced apart from the first pad, and not in contact with the TSVs; a second redundancy pad on the second surface of the second stack and spaced apart from the second pad; and a redundancy bump connecting the first redundancy pad and the second redundancy pad, wherein the first pad and first redundancy pad are electrically connected to each other, and the second pad and second redundancy pad are electrically connected to each other.