TSV Semiconductor Package Reinforcement for Thin-Die Strength
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Solution Overview
Problem
As semiconductor components become thinner, their structural strength decreases, making them susceptible to damage during manufacturing processes, which lowers yield.
Innovation Solution
Incorporating a reinforcement layer on the surface of semiconductor components, which acts as a stress buffer and increases structural strength, preventing damage during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of electronic components is reduced to achieve better electrical performance and more functions, then the electrical performance and functionality are improved, but the structural strength decreases making components susceptible to damage during manufacturing
Solution Approach 1:
The patent introduces a reinforcement layer as a separate structural element distinct from the electronic component itself. This reinforcement layer is disposed on the back surface of the electronic component, creating a composite structure where the thin electronic component maintains its electrical performance while the added reinforcement layer provides the necessary structural strength to prevent damage during manufacturing processes.
2Adaptability or versatility
If the thickness of electronic components is reduced, then more functions can be integrated into a single package, but the stress during manufacturing process may damage the electronic components decreasing yield
Solution Approach 1:
The reinforcement layer is introduced as a preventive measure before the manufacturing process begins. By disposing the reinforcement layer on the back surface of the electronic component prior to subsequent manufacturing steps, the structure is pre-prepared to withstand stresses from processes such as singulation, wire bonding, and molding, thereby preventing damage and maintaining high manufacturing yield while enabling thin-component multi-function integration.
Data Source
AI summary
A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.