Through-Silicon Via Data Output via Segmented Read Path
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face challenges in fully outputting data from the master chip during failure testing due to the capacitance of through electrodes, which affects data swing under low operating voltage and high-speed conditions.
Innovation Solution
The semiconductor device includes a through electrode, metal pads for external coupling, a data input block, a through electrode storage block, and a data output block that allows data to be transferred and outputted without passing through the metal pads, thereby avoiding capacitance influence during read operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If data is outputted through the through electrode during read operation, then electrical connection is provided, but data cannot fully swing due to capacitance of the through electrode
Solution Approach 1:
The patent segments the data output path into two separate paths: one for write operations (through the through electrode) and one for read operations (through a separate pad). This segmentation allows each path to be optimized for its specific function, preventing the capacitance of the through electrode from affecting read operations.
Solution Approach 2:
The patent extracts the read operation data path from the through electrode and creates a separate dedicated path. By taking out the read function from the through electrode, the harmful capacitance effect is eliminated from the read operation while the through electrode remains available for write operations.
2Productivity
If low operating voltage and high speed conditions are used, then productivity is improved, but data cannot fully swing due to capacitance
Solution Approach 1:
The patent introduces a separate pad as an intermediary element for read operations. This intermediary provides a low-capacitance path between the master chip and slave chips, enabling high-speed data transfer with full signal swing even at low operating voltages.
3Reliability
If data is latched and outputted through through electrode, then electrical connection is established, but data collision may occur between master and slave chips
Solution Approach 1:
The patent segments the data paths temporally and spatially: write operations use the through electrode path while read operations use the separate pad path. This segmentation prevents data collision by ensuring that master chip data output and slave chip data input occur through different physical paths.
Data Source
AI summary
A semiconductor device includes a through electrode vertically passing through the semiconductor device; a metal pad electrically coupling the through electrode and an exterior; a data input block suitable for transferring a data signal to the metal pad in response to a write command; a through electrode storage block suitable for storing the data signal transferred through the metal pad; and a data output block suitable for outputting the data signal, which is stored in the through electrode storage block, to the exterior in response to a read command.