TSV RFIC Dice with Vertically Integrated Phased-Array Antennas
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Solution Overview
Problem
Current radio-frequency integrated circuits (RFICs) face challenges in miniaturization and signal congestion due to the large form factor and impedance variations between phased-array antenna elements, which hinder efficient operation, especially in high-frequency applications like 60 GHz millimeter-wave communications.
Innovation Solution
The integration of through-silicon via (TSV) RFIC dice with phased-array antenna substrates in a vertically stacked configuration, using TSVs to connect the RFIC die to the antenna elements, allows for a smaller form factor, uniform impedance, and separation of RF and lower frequency functions, reducing signal congestion and enabling efficient operation across a wide frequency range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If phased-array antenna elements are integrated with RFICs in a conventional planar configuration, then the system can operate at high frequencies, but the form factor becomes large and signal congestion occurs
Solution Approach 1:
The patent transitions from a conventional planar configuration to a three-dimensional vertically stacked configuration. The RFIC die is positioned beneath the antenna substrate and connected via through-silicon vias (TSVs), utilizing the vertical dimension to reduce the horizontal footprint while maintaining functional integration. This dimensional change directly addresses the form factor issue without introducing additional signal congestion.
2Volume of moving object
If phased-array antenna elements are closely integrated with RFICs, then miniaturization is achieved, but impedance variations between antenna elements increase
Solution Approach 1:
The patent extracts the RFIC functionality from the antenna substrate plane and places it on a separate die beneath the substrate. This separation allows the antenna elements to be optimized for impedance uniformity on the substrate surface while the RFIC die handles signal processing. The TSV connections provide controlled impedance pathways, ensuring that miniaturization does not compromise impedance matching across the phased-array elements.
3Device complexity
If RF and lower frequency functions are integrated on the same substrate, then device complexity is reduced, but signal congestion increases
Solution Approach 1:
The patent segments the system into distinct functional components: the antenna substrate containing phased-array elements operating at high frequencies (e.g., 60 GHz), and a separate RFIC die handling lower frequency signal processing. These segments are vertically stacked and connected via TSVs, allowing each component to operate in its optimal frequency range without causing signal congestion to the other, while maintaining a compact integrated form factor.
Data Source
AI summary
An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.