TSV Semiconductor Package Reducing Solder Ball Count
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Solution Overview
Problem
Existing methods for mounting semiconductor device packages to circuit boards face challenges in manufacturing thinner electronic devices due to the reliance on large numbers of solder balls, which are inadequate for complex semiconductor devices, especially in 'flip chip' and 'chip on chip' technologies.
Innovation Solution
The use of through-silicon vias (TSVs) to directly connect semiconductor dies to circuit boards, combined with solder bumps and balls for attachment, reduces the need for extensive solder ball arrays and enables more compact and complex electronic device designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used to mount semiconductor device packages to circuit boards, then the semiconductor devices can be connected and mounted, but the number of solder balls required becomes large, making it difficult to manufacture thinner electronic devices
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional stacking by introducing through-silicon vias (TSVs) that enable vertical interconnections. Multiple semiconductor dies are stacked in the Z-direction and connected via TSVs, allowing high-density interconnection without increasing the lateral footprint or requiring extensive solder ball arrays, thereby reducing device thickness while maintaining connection reliability
Solution Approach 2:
The patent introduces TSVs as intermediary conductive structures that mediate the connection between stacked semiconductor dies and the circuit board. These TSVs act as vertical interconnectors that replace the need for numerous solder balls, enabling direct through-silicon conduction and reducing the overall device thickness while ensuring reliable electrical connections
2Adaptability or versatility
If large numbers of solder balls are used for mounting, then connectivity can be achieved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the interconnection function into two distinct components: TSVs for vertical through-silicon conduction and a reduced number of solder balls for lateral bonding to the circuit board. This segmentation eliminates the need for extensive solder ball arrays while maintaining full connectivity, thereby reducing device complexity and manufacturing difficulty
Solution Approach 2:
The patent moves interconnection from a two-dimensional solder ball array on the package surface to a three-dimensional vertical stacking architecture using TSVs. This dimensional transition enables high-density connectivity through the Z-axis, reducing the complexity of lateral solder ball arrangements while maintaining comprehensive electrical connections
3Ease of manufacture
If traditional mounting methods are used, then semiconductor dies can be packaged and mounted, but thinner electronic device designs are not achievable
Solution Approach 1:
The patent performs preliminary actions by pre-forming TSVs through the semiconductor dies during the semiconductor fabrication process, before packaging and mounting. This preliminary creation of vertical interconnectors enables subsequent thin-profile packaging and mounting operations, making it manufacturable to produce thinner electronic devices while maintaining ease of manufacturing through standardized processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of smaller, thinner electronic devices by reducing the number of solder balls required and facilitating 'chip on chip' technologies, enhancing the connectivity and compactness of semiconductor device packages.
Implementation Method 1
through-silicon vias (TSVs) conductively connecting the active side to the inactive side
Implementation Method 2
attached to the semiconductor die at the active side thereof via solder bumps
Implementation Method 3
solder balls at the side of the laminate layer attached to the semiconductor die, around the semiconductor die
Data Source
AI summary
An electronic device includes a circuit board and a semiconductor device package. The semiconductor device package includes a laminate layer. The semiconductor device package includes a semiconductor die having an active side, an inactive side opposite the active side, and through-silicon vias (TSVs) conductively connecting the active side to the inactive side and conductively connecting the semiconductor die to one of the laminate layer and the circuit board. The semiconductor device package includes a laminate layer having a side attached to the active side or the inactive side semiconductor die. The semiconductor device package includes solder balls at the side of the laminate layer attached to the semiconductor die, around the semiconductor die, and attached to the circuit board.