TSV Circuit Testing Interface Using Segmented Pads and Switch Module

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Solution Overview

Problem

Conventional methods for testing off-chip drivers and input buffers through silicon vias (TSVs) face challenges due to the small surface area of TSVs, leading to unreliable probing and increased parasitic capacitance when test pads are used, which deviates from the low maximum pin capacitance specification.

Innovation Solution

A circuit testing interface comprising a test current transmitting pad, a test voltage measuring pad, and a switch module that allows for electrical connection and disconnection between these pads and the driving circuit, enabling testing without direct contact to the TSV, thereby reducing testing costs and avoiding parasitic capacitance issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional test pad is attached to the TSV with an on-die metal trace, then the TSV can be probed for testing, but the parasitic capacitance increases significantly beyond the maximum pin capacitance specification

Engineering Contradiction:

Improveprobing reliabilityVSAvoidparasitic capacitance

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The test interface is segmented into separate test current transmitting pad and test voltage measuring pad, allowing independent optimization of each pad's function without requiring direct TSV probing

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A switch module is introduced as an intermediary component between the TSV and test pads, enabling test signal transmission through alternative paths that avoid direct TSV probing and reduce parasitic capacitance

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If conventional test probes are used to directly contact the TSV, then testing can be performed, but the small surface area of the TSV leads to unreliable probing

Engineering Contradiction:

Improvetesting accessibilityVSAvoidprobing reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The test interface moves from direct vertical probing of the small TSV surface to a lateral pad-based interface, changing the dimensional approach to testing and enabling use of standard larger-area test probes

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If the TSV is used for both functional operation and testing, then the structure remains simple, but the test pad attachment causes capacitance issues that affect functional performance

Engineering Contradiction:

Improvestructure complexityVSAvoidparasitic capacitance

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The interface is segmented into functional paths (TSV for normal operation) and test paths (test pads through switch module), allowing independent optimization without interfering with each other

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The switch module provides dynamic reconfiguration capability, allowing the system to switch between functional mode (direct TSV connection) and test mode (test pad connection through switch module) based on operational requirements

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS8704541B2Test method of driving apparatus and circuit testing interface thereof

Publication Date: 2014.04.22 NAN YA TECH

AI summary

A circuit testing interface and test method are disclosed. The circuit testing interface may include a test current transmitting pad, a test voltage measuring pad, and at least one driving circuit comprising an output terminal. The output terminal of the at least one driving circuit may be coupled to a through-silicon via (TSV). The circuit testing interface may further include at least one switch module, coupled to (1) the output terminal of the driving circuit, (2) the test current transmitting pad, and (3) the test voltage measuring pad.