3D IC Temperature Sensing via TSV Thermal Conduction
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Solution Overview
Problem
Three-dimensional integrated circuits face challenges in designing a temperature sensing system with low complexity and cost due to varying manufacturing techniques across different chip layers, leading to increased design complexity and calibration difficulties, especially with heat dissipation and hot spots.
Innovation Solution
A temperature sensing system utilizing a master temperature sensor on a master layer connected via a thermal conductive structure, including metal thermal conductive parts and Through Silicon Vias (TSVs) formed by Copper Damascene, to measure and calibrate temperature variance across slave layers, reducing design complexity and implementation costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If different chip layers are fabricated by different manufacturing techniques with different temperature sensors, then temperature sensing coverage is improved, but design complexity increases dramatically
Solution Approach 1:
The patent merges temperature sensing functionality from multiple slave layers into a single master layer by conducting temperatures from different chip layers to the same master layer through TSVs. This consolidation reduces the number of temperature sensors and simplifies the overall sensing system while maintaining comprehensive temperature monitoring coverage across all layers.
Solution Approach 2:
The patent introduces TSVs (Through Silicon Vias) as intermediary thermal conduction paths to transfer temperature information from slave layers to the master layer. These TSVs act as thermal mediators that enable temperature sensing across multiple layers without requiring independent sensors on each layer, thereby reducing system complexity.
2Measurement precision
If different temperature sensors are used on different chip layers, then temperature measurement capability is improved, but calibration difficulty increases
Solution Approach 1:
The patent combines multiple temperature sensing operations into a single calibration process on the master layer. By conducting temperatures from different layers to the master layer, the calibration of all temperature sensors can be performed simultaneously through one master temperature sensor, dramatically simplifying the calibration mechanism and reducing the number of calibration signals needed.
3Device complexity
If Through Silicon Vias are used to conduct temperature from different chip layers, then design complexity is reduced, but chip area is occupied
Solution Approach 1:
The patent makes TSVs multi-functional by using them for both electrical interconnection and thermal conduction purposes. This dual functionality allows the same TSV structure to serve communication and temperature sensing roles simultaneously, reducing the need for additional dedicated thermal conduction paths and minimizing the overall chip area required for temperature sensing infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces design complexity and implementation costs by centralizing temperature sensors on a master layer, minimizing chip area, and simplifying calibration, while maintaining reliability and dynamic temperature control across 3D ICs.
Implementation Method 1
the thermal conductive structure is used to conduct the temperature to the master layer by the TSV
Data Source
AI summary
A system and a method for temperature sensing of three-dimensional integrated circuits are revealed. The three-dimensional integrated circuit is formed by stacking of a plurality of chip layers that execute specific functions. The chip layer includes a master layer and at least one slave layer. The master layer is disposed with a master temperature sensor while a first thermal conductive part is arranged at the slave layer where heat is detected. The first thermal conductive part and the master temperature sensor are connected by a thermal conductive structure. Thereby temperature of various points at different chip layers is conducted to the same chip layer by Through Silicon Vias to be measured and calibrated. The design complexity and the implementation cost of the temperature sensing system are significantly reduced.