Permanent TSV Wafer Handler for Qubit Chip Thermalization
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Solution Overview
Problem
Conventional packaging methods for superconducting quantum processors require the removal of a substrate handler, which can damage the qubit chip and other components, and do not effectively dissipate heat generated by the qubits.
Innovation Solution
A quantum device with a substrate handler that remains integrated, featuring vias filled with non-superconducting materials for heat dissipation and superconducting materials for electrical connections, providing additional rigidity and heat dissipation while allowing for laser or plasma access to modify qubits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a plain substrate handler is used to strengthen the substrate during manufacture, then the substrate strength is improved, but the substrate handler must be removed in the final structure which can damage the qubit chip and other components
Solution Approach 1:
The patent extracts the substrate handler's mechanical support function from its traditional temporary role and makes it a permanent integrated component. The handler remains bonded to the qubit chip substrate throughout the device lifecycle, eliminating the need for removal while continuing to provide structural strength and support to the fragile qubit chip.
Solution Approach 2:
The patent merges the substrate handler with the qubit chip assembly into a single integrated structure. The handler is permanently bonded to the substrate and serves multiple functions simultaneously: structural support, heat dissipation pathway, and mechanical reinforcement, eliminating the need for separate removal steps that could damage components.
2Stability of the object's composition
If vias are formed in a qubit chip substrate to break box mode, then the electromagnetic mode control is improved, but the substrate becomes weak and fragile
Solution Approach 1:
The patent segments the via structure into multiple components: through-silicon vias (TSVs) that penetrate the substrate and are filled with conductive material. This segmentation allows the vias to serve electromagnetic control functions while the surrounding substrate material and integrated handler provide mechanical reinforcement, compensating for the structural weakness introduced by the vias.
Solution Approach 2:
The patent uses composite material structures where vias are filled with conductive materials (such as copper or superconducting materials) rather than leaving them empty. This composite approach allows the via regions to provide electromagnetic control while the filled material and surrounding substrate create a reinforced structure that maintains mechanical strength despite the presence of vias.
3Ease of manufacture
If the substrate is thinned to form vias, then the via formation is improved, but the substrate becomes weak and fragile
Solution Approach 1:
The patent performs preliminary substrate thinning and via formation early in the manufacturing process, before the final device assembly. The substrate is thinned and vias are formed while the substrate is still relatively robust, and then the substrate handler is integrated to provide ongoing mechanical support. This preliminary action allows easy via formation while the subsequent integration of the handler compensates for the strength loss.
4Ease of manufacture
If conventional packaging methods are used, then the substrate handler can be removed, but the final structure may be damaged during removal
Solution Approach 1:
The patent extracts the substrate handler from the temporary support role in conventional packaging and transforms it into a permanent structural component. By removing the requirement to remove the handler, the patent eliminates the damage risk associated with removal while maintaining all the mechanical support benefits throughout the device lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated substrate handler enhances structural rigidity and heat dissipation, eliminating the need for substrate removal and enabling controlled qubit modifications, thus improving the reliability and performance of quantum devices.
Implementation Method 1
At least a portion of plurality of vias are filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both
Implementation Method 2
a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both
Data Source
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AI summary
A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.