TTFields Electrode Assembly With Anisotropic Cover
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Solution Overview
Problem
Existing Tumor Treating Fields (TTFields) therapy electrode assemblies experience uneven heating and current distribution due to dielectric materials close to the skin, leading to localized heating and reduced flexibility of the treatment apparatus.
Innovation Solution
The use of a treatment assembly with a circuit board, electrode elements, and a cover featuring anisotropic material and conductive adhesive or gel layers, which directs heat away from the skin and allows for faster cooling, providing a more uniform current distribution and increased flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If dielectric elements are positioned close to the skin with only soft adhesive material separation, then the treatment apparatus can be compact, but this leads to increased heating and slow cooling of the skin
Solution Approach 1:
The patent introduces a thermal management layer as an intermediary component between the dielectric elements and the skin. This layer acts as a heat sink and thermal barrier, absorbing excess heat generated during TTFields therapy and preventing it from transferring to the skin, thereby resolving the heating issue while maintaining compact apparatus design
Solution Approach 2:
The patent modifies the thermal properties of the interface between the apparatus and skin by incorporating materials with specific thermal conductivity characteristics. The thermal management layer changes the thermal parameters of the system, enabling better heat dissipation and cooling rates without increasing apparatus volume
2Manufacturing precision
If large printed circuit boards are used to support increased number of dielectric elements, then current distribution consistency improves, but the footprint and rigidity of the treatment apparatus increase
Solution Approach 1:
The patent employs flexible circuit boards instead of large rigid printed circuit boards. These flexible circuits can be conformally arranged to support multiple dielectric elements while maintaining a compact footprint. The flexibility allows for optimized element placement without requiring large rigid substrate areas
Solution Approach 2:
The patent arranges dielectric elements and circuit board components in a nested or layered configuration where elements are positioned in overlapping or adjacent layers. This nesting approach allows for a higher density of dielectric elements to be supported on a smaller footprint circuit board, maintaining current distribution uniformity without increasing overall apparatus size
3Reliability
If concentrated current flows at the interfaces between dielectric elements and soft adhesive material, then electrical connection is achieved, but inconsistent heating and localized current spikes occur
Solution Approach 1:
The patent applies local quality modification by introducing a thermal management layer specifically at the interfaces where current concentration occurs. This layer has localized thermal properties that differ from other parts of the apparatus, providing targeted heat dissipation at the problematic interface regions to prevent localized heating and current spikes while maintaining electrical connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces skin heating, enhances cooling, and ensures a consistent current distribution across the treatment area, allowing for smaller and more flexible treatment assemblies while maintaining effective TTFields delivery.
Implementation Method 1
the sheet having a first thermal conductivity in a direction that is perpendicular to the front face, wherein thermal conductivity of the sheet in directions that are parallel to the front face is more than two times higher than the first thermal conductivity
Implementation Method 2
at least one conductive adhesive or gel layer. Any contact between the cover and an electrode element of the plurality of electrode elements occurs by contact with a conductive adhesive or gel layer
Implementation Method 3
The alternating electric fields are induced by electrode assemblies (e.g., arrays of capacitively coupled electrodes, also called transducer arrays) placed on opposite sides of a target location in the subject's body
Data Source
AI summary
Assemblies for use in applying TTFields are disclosed. A treatment assembly can include a circuit board, a plurality of electrode elements, and a cover. Each electrode element of the plurality of electrode elements can have a metal layer and, optionally, a capacitive layer. Each electrode element can be coupled to the circuit board via the metal layer of the electrode element. At least a first electrode element of the plurality of electrode elements can be positioned on an outer side of the circuit board. A first portion of the cover can be disposed over the first electrode element and the outer side of the circuit board, and the first portion can contact the first electrode. A second portion of the cover can be positioned radially outside of a perimeter of the circuit board. The cover can include a layer of anisotropic material and at least one conductive adhesive or gel layer.