Tubelike Computer Module Airflow Channel Design
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Solution Overview
Problem
High-density blade architectures in HPC systems face challenges with heat dissipation and noise reduction due to narrow airflow channels, which lead to reduced airflow rates and increased turbulence and noise levels.
Innovation Solution
A multi-processor system with a tubelike computer module that defines a unitary, continuous, non-segment airflow channel by configuring motherboards along the side walls of a rack body, reducing barriers and allowing smoother airflow, thereby enhancing heat dissipation efficiency and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If narrow split spaces are used in blade architecture, then high density is achieved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The invention segments the airflow channel into multiple parallel paths by configuring motherboards along side walls, creating a non-segment airflow channel structure that maintains high density while improving heat dissipation through increased airflow distribution
Solution Approach 2:
The invention transitions from a two-dimensional planar airflow channel to a three-dimensional tubelike structure, allowing airflow to pass through the interior space of the rack body, thereby increasing heat dissipation efficiency without compromising density
2Quantity of substance
If narrow split spaces are used in blade architecture, then high density is achieved, but noise level increases
Solution Approach 1:
The airflow channel is segmented into multiple parallel paths along the side walls, reducing turbulence in each individual path and thereby lowering wind noise while maintaining high system density
Solution Approach 2:
By creating a three-dimensional tubelike airflow channel that passes through the rack body interior, the invention reduces airflow resistance and turbulence compared to traditional two-dimensional narrow channels, resulting in lower noise levels
3Temperature
If fan rotation speed is increased to maintain airflow rate, then heat dissipation is improved, but operation noise increases
Solution Approach 1:
The invention changes the geometric parameters of the airflow channel from narrow split spaces to a larger tubelike structure, allowing sufficient heat dissipation at lower fan rotation speeds, thereby reducing operation noise
Solution Approach 2:
The three-dimensional tubelike airflow channel provides a larger cross-sectional area for heat dissipation, enabling the system to achieve required cooling performance without increasing fan speed, thus avoiding additional operation noise
4Quantity of substance
If turbulent airflow is generated in narrow channels, then airflow rate is reduced, but heat dissipation requirement increases
Solution Approach 1:
The invention creates a three-dimensional tubelike airflow channel that reduces turbulence and increases airflow rate compared to traditional two-dimensional narrow channels, thereby meeting heat dissipation requirements without additional cooling capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves optimal heat dissipation and noise reduction by ensuring smooth airflow and reducing the need for high-speed fans, resulting in improved cooling efficiency and lower operational noise.
Implementation Method 1
The airflows 14 sucked-in from the front side of the rack 10 will first flow into each of the split spaces, then pass the fans 13 and eventually flow out through the rear side of the rack 10
Implementation Method 2
The heat sinks are coupled corresponding to the processors of the mother boards
Data Source
AI summary
A multi-processor system has a tubelike computer module including plural mother boards configured onto plural side walls of a rack body to form a unitary, continuous and non-segment airflow channel. The airflow channel of the tubelike computer module has larger space and fewer barriers to allow the airflow passing through smoothly, and to reduce wind noises or turbulences. Therefore, the system achieves optimum heat-dissipation efficiency and noise reduction by means of specific space arrangement and less cooling system requirement.