Tubular Memory Module for Blade Server Thermal Management
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Solution Overview
Problem
Space-constrained computer systems, such as blade servers, face challenges in fitting increased memory capacity and performance while managing thermal and power demands, particularly in compact designs where traditional memory modules are difficult to cool efficiently.
Innovation Solution
A tubular memory module design featuring a flexible circuit with memory chips secured to a substrate and electrical terminals along a card edge, integrated within a tubular frame that allows for efficient airflow and heat dissipation, with the flexible circuit optionally secured to the interior or exterior of the frame, providing a high-capacity DRAM arrangement and protection from mechanical damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional memory modules are used in compact systems, then memory capacity can be increased, but thermal dissipation and cooling efficiency deteriorate
Solution Approach 1:
The patent transitions from traditional planar memory module layouts to a three-dimensional tubular structure. Memory chips are arranged radially around a central axis within the tubular frame, utilizing vertical and radial space rather than only horizontal plane space. This dimensional change enables superior airflow patterns through the module, with cooling air entering through central channels and exiting through peripheral channels, significantly improving thermal dissipation while accommodating high memory capacity.
2Quantity of substance
If memory capacity is increased in compact systems, then performance improves, but available space deteriorates
Solution Approach 1:
The patent implements a nested configuration where memory chips are mounted on flexible circuit boards that are themselves nested within the tubular frame structure. Multiple layers of flexible circuits with memory chips are arranged concentrically, with each layer nested within the spatial envelope of the tubular frame. This nesting approach maximizes memory density within the compact cylindrical volume, achieving high capacity without proportionally increasing external dimensions.
3Quantity of substance
If memory chips are densely packed to increase capacity, then performance improves, but mechanical protection deteriorates
Solution Approach 1:
The patent employs a composite structural approach combining rigid tubular frame elements with flexible circuit board substrates. The rigid frame provides mechanical protection and structural integrity, while the flexible circuits allow for controlled movement and stress absorption. The tubular frame acts as a protective enclosure that shields densely packed memory chips from external mechanical shocks and vibrations, maintaining reliability despite high-density packing.
Data Source
AI summary
Memory systems and methods of forming memory modules. In one embodiment, a computer memory system includes a substantially tubular frame with an elongate card edge extending along the frame. A flexible circuit comprising a flexible substrate, a plurality of memory chips affixed to the flexible substrate, and a plurality of electrical terminals interconnected with the memory chips, is secured along a perimeter of the tubular frame with the electrical terminals arranged along the card edge.