Tubular Target Arrangement with Segmented Solder Bridges
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Solution Overview
Problem
Target arrangements with tubular targets face challenges in achieving reliable thermal dissipation and mechanical stability due to differing thermal expansion coefficients between ceramic and metal materials, leading to potential connection loosening and damage during sputtering processes.
Innovation Solution
A target arrangement with partially continuous connections using plastically deformable compensation means, such as soft solder or spring members, to accommodate thermal expansion differences and enhance heat transfer between the tubular target and carrier member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a full-area solder connection with material continuity is used to connect the metallic carrier member and ceramic tube segment, then thermal dissipation is improved, but the connection becomes unreliable due to different thermal expansion coefficients causing loosening and damage
Solution Approach 1:
The patent divides the continuous solder connection into discrete solder bridges spaced at intervals around the tubular target. This segmentation allows each solder bridge to independently accommodate thermal expansion differences between the metallic carrier member and ceramic tube segment, preventing the connection loosening and damage that would occur with a full-area continuous solder connection while still providing adequate thermal dissipation through multiple connection points.
Solution Approach 2:
The patent changes the physical state and properties of the solder by using a plastically deformable material that can undergo permanent deformation. This parameter change allows the solder bridges to adapt to thermal expansion differences through plastic deformation rather than elastic deformation or fracture, maintaining connection reliability while enabling improved thermal dissipation.
2Stability of the object's composition
If elastic clamping elements are used to fasten the target to the carrier member, then mechanical stability is achieved, but thermal dissipation remains moderate
Solution Approach 1:
The patent merges the mechanical fastening function and thermal conduction function into a single solder bridge structure. The solder bridges provide both mechanical support to hold the tubular target in position on the carrier member and thermal conduction pathways to dissipate heat, eliminating the need for separate elastic clamping elements and achieving both mechanical stability and improved thermal dissipation simultaneously.
Solution Approach 2:
The patent uses solder as a composite material that combines the properties of a metallic bonding agent with adequate plasticity and thermal conductivity. This composite material approach allows the solder bridges to fulfill both mechanical fastening and thermal conduction roles, overcoming the limitation of elastic clamping elements that provide mechanical stability but only moderate thermal dissipation.
3Reliability
If adhesive bonding is used to compensate for different thermal expansion coefficients, then connection reliability is improved, but heat conduction properties are insufficient
Solution Approach 1:
The patent changes the material selection from adhesive (polymer-based) to solder (metallic), fundamentally altering the thermal conduction parameter. Solder provides both the reliability needed to accommodate thermal expansion differences through plastic deformability and the heat conduction properties necessary for effective thermal dissipation, overcoming the insufficient heat conduction of adhesive bonding materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved thermal dissipation, allowing for increased power density in sputtering processes, higher target utilization, and reduced risk of damage, resulting in an economically efficient sputtering process.
Implementation Method 1
the carrier member and each tubular segment are partially connected to one another with material continuity by at least two plastically deformable compensation means
Implementation Method 2
an improved thermal dissipation between the target and the carrier member is achieved by means of such a force-transmitting connection
Data Source
AI summary
The invention relates to a target arrangement comprising a tubular-shaped carrier element and a hollow-cylindrical target having at least one target material, said target comprising at least one one-piece tube segment which at least partially surrounds the carrier element. Said carrier element and the tube segment are partially interconnected in a material fit by at least two plastically deformable compensating means. The invention also relates to a method for producing said type of target arrangement and a tubular segment.