Tubular Wafer Transfer Link for Notch Alignment and Compact Layout
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Solution Overview
Problem
Existing wafer processing apparatuses face challenges such as increased footprint and misalignment of notch direction when additional processing modules are attached, leading to inefficiencies in throughput and processing uniformity.
Innovation Solution
A transfer apparatus is designed with a tubular connecting module and rotation mechanisms that connect vacuum transfer modules, allowing for simultaneous transfer of wafers and rings, and aligning the notch direction of wafers during transfer, thereby reducing footprint and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vacuum transfer modules are connected to increase the maximum number of processing modules, then processing capacity is improved, but footprint increases
Solution Approach 1:
The wafer support is rotatably attached to the tubular connecting module, allowing the wafer support to rotate within the confined space of the tubular connector. This nesting arrangement enables functional movement without increasing the external footprint of the connecting module.
Solution Approach 2:
Instead of extending the connecting module linearly to accommodate wafer transfer and rotation functions, the invention uses rotational movement in a circular dimension within the tubular space. This dimensional change allows multiple processing modules to be connected without proportionally increasing the linear footprint.
2Manufacturing precision
If a rotation module is provided to align substrate notch direction, then processing uniformity is improved, but device complexity increases
Solution Approach 1:
The tubular connecting module serves multiple functions: it connects vacuum transfer modules, supports wafer transfer, and enables notch alignment through rotation. By integrating these functions into a single component, the invention avoids adding separate rotation modules, thereby maintaining processing uniformity while minimizing device complexity.
Solution Approach 2:
The invention combines the connecting function and the rotation function into the tubular connecting module. The wafer support rotates within the tubular connector, merging what would traditionally be separate components into one integrated structure, thus reducing overall system complexity.
Data Source
AI summary
A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.