Tunable Electrostatic Chuck Heating Zones for RAP Temperature Uniformity
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Solution Overview
Problem
Existing substrate processing systems face challenges in achieving uniform temperature control across the substrate support during rapid alternating processes (RAP), leading to non-uniformities in etch and deposition processes.
Innovation Solution
A temperature-tunable substrate support with multiple zones and thermally conductive bond layers is implemented, allowing for independent temperature control of each zone to compensate for temperature variations and process non-uniformities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a single temperature control system is used for the substrate support, then the device complexity is reduced, but temperature uniformity across the substrate cannot be maintained during rapid alternating processes
Solution Approach 1:
The substrate support is divided into multiple independently controllable heating zones (first heating element for first zone, second heating element for second zone). Each zone can be controlled separately to maintain uniform temperature distribution across the entire substrate support during rapid alternating deposition and etching processes.
Solution Approach 2:
Different zones of the substrate support are equipped with different heating elements and thermal conductive bond layers tailored to specific thermal requirements. The first thermally conductive bond layer has different thickness and thermal conductivity characteristics compared to the second, allowing localized optimization of heat transfer in different regions.
2Use of energy by moving object
If thermally conductive bond layers with high thermal conductivity are used, then heat transfer efficiency is improved, but temperature control precision is reduced due to excessive heat loss
Solution Approach 1:
The thermal conductivity and thickness parameters of the thermally conductive bond layers are precisely optimized. The first thermally conductive bond layer has a thickness between 50-100 μm and thermal conductivity between 0.5-1.0 W/mK, while the second has thickness 200-300 μm and thermal conductivity 0.1-0.6 W/mK. These specific parameter ranges balance heat transfer efficiency with temperature control precision.
Solution Approach 2:
Different thermally conductive bond layers with distinct thermal properties are used in different zones. The first bond layer has higher thermal conductivity for efficient heat transfer in its zone, while the second bond layer has lower thermal conductivity to prevent excessive heat loss in its zone, achieving local thermal optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise temperature control across the substrate support, reducing non-uniformities in etch and deposition processes, and maintaining suitable temperatures for both etch and deposition steps during RAP.
Implementation Method 1
A first thermally conductive bond layer arranged between the heating plate and the baseplate. The first thermally conductive bond layer is configured to transfer heat from the heating plate to the baseplate during the rapid alternating process.
Implementation Method 2
The heating plate includes a first zone including a first heating element configured to adjust a first temperature of the first zone of the heating plate and a second zone including a second heating element configured to adjust a second temperature of the second zone of the heating plate.
Data Source
AI summary
A substrate support for a substrate processing chamber configured to implement a rapid alternating process includes a baseplate and a heating plate arranged on the baseplate. The heating plate includes a first zone including a first heating element configured to adjust a first temperature of the first zone of the heating plate and a second zone including a second heating element configured to adjust a second temperature of the second zone of the heating plate. A first thermally conductive bond layer is arranged between the heating plate and the baseplate. The first thermally conductive bond layer is configured to transfer heat from the heating plate to the baseplate during the rapid alternating process. The rapid alternating process includes a plurality of alternating deposition steps and etching steps.