3D Tunable Filter Package for Compact RF Design
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Solution Overview
Problem
Tunable filters for communication devices require a multitude of components, leading to increased space and complexity in interconnections, which complicates the handling of multiple frequency bands and results in higher electrical losses and reduced frequency accuracy.
Innovation Solution
A 3D integrated package for tunable filters with high-quality tunable passive components and discrete passive devices, where the semiconductor device is integrated with tunable capacitors and inductances, and discrete inductances are positioned close to circuit nodes to minimize couplings, allowing for compact design and high-frequency accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a multiplicity of components is used for tunable filters, then frequency band adaptability is improved, but device complexity and space requirements increase
Solution Approach 1:
The filter system is segmented into multiple independently controllable resonator units, each capable of operating at different frequency bands. This allows the filter to achieve multi-band adaptability by selectively activating specific resonators rather than using a complex interconnected filter network, thereby reducing overall device complexity while maintaining frequency band versatility.
Solution Approach 2:
The filter employs dynamically controllable impedance elements that can be adjusted in real-time to reconfigure the filter response for different frequency bands. This dynamic adjustment capability eliminates the need for multiple fixed-frequency filter components, achieving frequency band adaptability through a single reconfigurable structure with reduced component multiplicity.
2Adaptability or versatility
If conventional interconnections are used for tunable filters, then frequency band switching is enabled, but conductor track crossings and couplings increase electrical losses
Solution Approach 1:
The harmful coupling effects and conductor track crossings are extracted and eliminated by using vertically stacked resonator structures with direct vertical interconnections. This removes the need for horizontal signal routing that causes parasitic couplings, thereby enabling frequency band switching without incurring additional electrical losses from complex interconnection paths.
3Adaptability or versatility
If more components are added for tunability, then frequency tuning capability is improved, but installation size increases
Solution Approach 1:
The filter design transitions from a planar two-dimensional layout to a three-dimensional stacked architecture. Multiple resonator units are arranged vertically in different layers and interconnected through vertical vias, enabling frequency tuning capability through selective activation of stacked resonators without increasing the horizontal footprint, thereby reducing overall installation size while maintaining tunability.
Data Source
AI summary
A package for a tunable filter is disclosed. In an embodiment, the tunable filter includes a substrate having a first interconnection plane and a semiconductor device assembled on the substrate in a first component plane, the semiconductor device electrically connected to the first interconnection plane and containing tunable passive components. The filter further includes a control unit arranged in the first component plane, a dielectric layer arranged above the first component plane, a second component plane arranged on the dielectric layer and discrete passive devices arranged in the second component plane and interconnected with the semiconductor device, wherein the tunable passive components are tunable by the control unit.