Tunable Inductive Elements for Wideband RF Modules
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Solution Overview
Problem
Current RF modules for 5G wireless applications have limited tuning capabilities, primarily relying on tunable capacitive elements, which restricts their operation to a single band and offers a narrow tuning range, making them inadequate for varying frequency requirements.
Innovation Solution
The integration of on-die and on-laminate tunable inductive elements in close proximity within an IC package, where a second inductor is positioned above a first inductor with a gap, allowing for online tuning by adjusting the inductance through switches, enabling operation across different frequency bands and tolerating component variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If tunable capacitive elements are used in RF modules, then the RF module can be tuned to different frequencies, but the tuning range is narrow and limited to a single band
Solution Approach 1:
The patent combines on-die inductive elements with on-laminate inductive elements in close proximity to create a hybrid tuning system. This merging of different inductor types enables broader frequency band adaptability while distributing the tuning complexity across multiple integrated components rather than requiring a single complex tuning mechanism
Solution Approach 2:
The patent implements dynamic tuning capability by integrating switches that can selectively connect or disconnect inductor segments. This allows the inductance value to be dynamically adjusted in real-time, enabling the RF module to adapt to different frequency bands and tolerate component variations through online tuning
2Adaptability or versatility
If on-die and on-laminate inductive elements are placed in close proximity for online tuning, then the tuning range and flexibility are improved, but the risk of electromagnetic interference and coupling between inductors increases
Solution Approach 1:
The patent introduces an intermediary dielectric layer with controlled properties between the on-die inductor and on-laminate inductor. This intermediary layer acts as a buffer that maintains the necessary magnetic coupling for tuning functionality while preventing excessive electromagnetic interference and unwanted coupling effects
Solution Approach 2:
The patent applies different design optimizations to different parts of the inductor structure. The on-die inductor uses specific trace geometries and layer configurations, while the on-laminate inductor uses different trace patterns and spacing, with each optimized for its specific location and function to minimize interference while maintaining tuning effectiveness
3Extent of automation
If multiple metal layers and electrical conductors are used to couple inductors, then the inductance can be tuned online, but the manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent segments the inductor structure into on-die and on-laminate portions, each with separate metal layers and connection points. This segmentation allows for modular manufacturing where each portion can be fabricated and tested independently before final assembly, reducing overall manufacturing complexity despite the advanced tuning capabilities
Solution Approach 2:
The patent implements a nested structure where the on-die inductor is positioned above and overlaps with the on-laminate inductor in the vertical dimension. This nested arrangement allows multiple functional layers to be stacked in a compact configuration, enabling online tuning functionality while maintaining a compact form factor that simplifies assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the RF module's ability to operate across multiple frequency bands and tolerate component variations, providing a wider tuning range and improved flexibility in RF front-end operations.
Implementation Method 1
a first inductor at least partially overlapping the second inductor, and wherein there is a gap between the first inductor and the second inductor
Data Source
AI summary
Apparatus implementing various structures to decrease the distance between two inductive elements for tuning an inductance with greater variability (a wider tuning range). One example integrated circuit (IC) package generally includes a laminate, a solder resist layer disposed on an upper surface of the laminate, and a semiconductor die disposed above the laminate and comprising a first inductor. At least a portion of a second inductor is disposed above a section of the solder resist layer, the first inductor at least partially overlaps the second inductor, and there is a gap between the first inductor and the second inductor.