Tunable Inductor Integrated in Package Substrate
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Solution Overview
Problem
Existing integrated device packages with external inductors have fixed inductance values, which cannot be tuned, and are often too large for mobile and wearable computing devices, making them unsuitable for compact form factors required by these devices.
Innovation Solution
A tunable inductor is integrated into the package substrate, utilizing a configuration with multiple terminals where some are live and others are dummy, allowing for different inductance values by selectively closing and opening switches, enabling real-time tuning of the inductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external inductor is mounted on the PCB, then the inductor provides fixed inductance value, but the device form factor becomes too large for mobile and wearable computing devices
Solution Approach 1:
The patent merges the inductor with the package substrate by integrating the inductor structure into the substrate layers. The inductor is formed using conductive traces and vias within the substrate itself, eliminating the need for a separate external inductor component. This integration reduces the overall device footprint while maintaining the required inductance function.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the die, enables electrical interconnections through vias and traces, and simultaneously functions as the inductor structure. This multi-functionality eliminates the need for dedicated external inductor components, reducing the device form factor.
2Reliability
If an external inductor is used, then the inductor provides fixed inductance, but the inductor cannot be tuned to meet changing operational conditions
Solution Approach 1:
The patent implements a tunable inductor structure where the inductance value can be dynamically adjusted during operation. Switches are integrated into the inductor circuit, allowing different portions of the inductor trace to be selectively connected or disconnected. This enables real-time tuning of the inductance value to adapt to changing operational conditions while maintaining a compact integrated form.
Data Source
AI summary
Some features pertain to a package substrate that includes at least one dielectric layer, an inductor in the at least one dielectric layer, a first terminal coupled to the inductor, a second terminal coupled to the inductor, and a third terminal coupled to the inductor. The first terminal is configured to be a first port for the inductor. The second terminal is configured to be a second port for the inductor. The third terminal is a dummy terminal. In some implementations, the package substrate includes a solder resist layer over the dielectric layer, where the solder resist layer covers the third terminal. In some implementations, the package substrate includes a solder interconnect over the third terminal, such that the solder resist layer is between the third terminal and the solder interconnect. In some implementations, the package substrate is coupled to a die comprising a plurality of switches.