Tunable Inductor in Package Substrate for Mobile Devices
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Solution Overview
Problem
Existing integrated device packages with fixed inductors are not tunable and occupy excessive space, making them unsuitable for mobile and wearable computing devices due to their inflexible form factor and fixed inductance values.
Innovation Solution
Incorporating a real-time tunable inductor in the package substrate, which includes a primary inductor and secondary inductors coupled to switches, allowing for configurable inductance by opening or closing these switches, enabling dynamic adjustment of inductance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a fixed inductor is mounted externally on the PCB, then the device achieves basic inductance functionality, but the device occupies excessive space and has a large form factor
Solution Approach 1:
The patent merges the inductor with the package substrate by fabricating the inductor structure using the same interconnect layers and dielectric materials as the substrate itself. This integration eliminates the need for separate external inductor components, reducing PCB space occupation while maintaining inductance functionality.
Solution Approach 2:
The patent implements switchable inductor configurations that allow the inductance value to be dynamically changed during device operation. Multiple inductor structures with different inductance values are provided, and switches enable selective connection of these structures to achieve real-time inductance tuning, thereby improving adaptability.
2Adaptability or versatility
If a fixed inductor is used, then the device structure is simple, but the inductance value cannot be adjusted to meet changing operational conditions
Solution Approach 1:
The patent divides the inductor into multiple segmented structures with different inductance values. Each segment can be independently connected or disconnected through switches, allowing the system to select appropriate inductance values for different operational conditions. This segmentation enables adaptability while keeping each individual segment relatively simple.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support, electrical interconnection, and hosts both the inductor structures and switching elements. This multi-functionality reduces overall device complexity by consolidating components that would otherwise require separate structures.
3Volume of moving object
If the inductor is integrated into the package substrate, then the form factor is reduced, but the inductance becomes fixed and non-tunable
Solution Approach 1:
The patent incorporates switches within the integrated inductor structure that enable real-time reconfiguration of the inductance value. The switches can connect or disconnect different inductor segments or tap points, allowing the effective inductance to be dynamically adjusted while the entire structure remains compact and integrated in the package substrate.
Solution Approach 2:
The patent utilizes multiple layers of interconnect structures within the package substrate to create three-dimensional inductor configurations. By using vertical stacking and multi-layer routing, the design achieves both compact volume and multiple inductance values through selective connection of different layer combinations.
Data Source
AI summary
Some features pertain to a device package that includes a die and a package substrate. The die includes a first switch. The package substrate is coupled to the die. The package substrate includes at least one dielectric layer, a primary inductor, and a first secondary inductor coupled to the first switch of the die. The first secondary inductor and the first switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal. The primary inductor is configurable to have different inductances by opening and closing the first switch coupled to the first secondary inductor. In some implementations, the primary inductor is configurable in real time while the die is operational. In some implementations, the die further includes a second switch, and the package substrate further includes a second secondary inductor coupled to the second switch of the die.