Tunable Laser Carrier Structure to Suppress Adhesive Wet-Spreading

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Solution Overview

Problem

Existing wavelength variable lasers face issues with adhesive wet-spreading during the mounting of semiconductor gain chips and Si photonic elements, which can deteriorate optical characteristics if not properly controlled.

Innovation Solution

A wavelength variable laser apparatus and manufacturing method that incorporate a carrier with a discontinuous shape, such as a counterbored or notched design, to prevent adhesive wet-spreading by disrupting the continuous contact surface, thereby suppressing adhesive spread and maintaining optical integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive is applied to the end surface of the carrier to adhere the photonics element, then the photonics element is securely fixed to the carrier, but the adhesive spreads uncontrollably (wet-spreading) onto the semiconductor gain chip, deteriorating optical characteristics

Engineering Contradiction:

Improvefixing reliability of photonics elementVSAvoidadhesive wet-spreading onto semiconductor gain chip

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The end surface of the carrier is divided into multiple regions: a first region for adhesive application, a second region for mounting the semiconductor gain chip, and a third region for mounting the photonics element. This segmentation prevents the adhesive from spreading onto the semiconductor gain chip by creating physical boundaries between the adhesive zone and the chip mounting zone.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the carrier's end surface are assigned different functions and properties. The first region has adhesive application capability, the second region has semiconductor gain chip mounting capability, and the third region has photonics element mounting capability. This local differentiation ensures that the adhesive remains confined to its designated area while maintaining effective bonding in other areas.

Inventive Principle:

Principle #3Local quality

2Strength

If adhesive is applied in a continuous manner to ensure complete coverage for secure bonding, then bonding strength is improved, but adhesive wet-spreading increases and contaminates the semiconductor gain chip

Engineering Contradiction:

Improvebonding strength between photonics element and carrierVSAvoidadhesive contamination of semiconductor gain chip

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The adhesive application area is segmented into a first region that is spatially separated from the semiconductor gain chip mounting region. This segmentation allows the adhesive to be applied in a controlled, localized manner that provides sufficient bonding strength without spreading onto the chip.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive application zone is extracted and separated from the chip mounting zone by defining distinct regions on the carrier. This extraction ensures that the adhesive's harmful spreading effect is isolated from the semiconductor gain chip while the bonding function is preserved in the designated third region.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If the carrier end surface is made flat and continuous to simplify manufacturing, then manufacturing process is simplified, but adhesive wet-spreading cannot be controlled

Engineering Contradiction:

Improvecarrier manufacturing simplicityVSAvoidadhesive spread control precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The carrier end surface is segmented into distinct functional regions that can be formed through standard manufacturing processes such as photolithography and etching. These segmented regions provide adhesive spread control without requiring complex or non-standard manufacturing techniques.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The discontinuous shape and regional differentiation are built into the carrier structure during manufacturing, before the adhesive application step. This preliminary structuring of the carrier surface ensures that subsequent adhesive application is automatically confined to the designated first region, achieving precision control through pre-designed geometric features rather than complex real-time control.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20240388057A1Wavelength variable laser apparatus and method of manufacturing wavelength variable laser apparatus

Publication Date: 2024.11.21 NEC CORP

AI summary

To provide a wavelength variable laser apparatus in which wet-spreading of an adhesive is suppressed when a semiconductor gain chip is mounted on a photonics element with an adhesive. A wavelength variable laser apparatus includes a semiconductor gain chip, a carrier on which the semiconductor gain chip is mounted, and a photonics element adhered to an end surface of the carrier with an adhesive. A lower end part in a longitudinal direction of the semiconductor gain chip is disposed in such a way as to face an upper end part in a longitudinal direction of the photonics element. Discontinuous shapes are formed on an area above a part of the end surface of the carrier to which the adhesive is applied.