Compact Tunable Laser Assembly with Optical Isolator
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Solution Overview
Problem
There is a constant industry challenge to reduce the size of tunable laser packages while maintaining performance and reliability, and to accommodate various form factors for use in optical transceivers and other applications.
Innovation Solution
A small, packaged tunable laser assembly with a rectangular housing of less than 0.6 cubic centimeters, featuring an electrical input interface, optical output interface, tunable semiconductor laser, focusing lens assembly, beam splitter, optical isolator, and photodiode, which allows for adjustable wavelength emission and stable operation by preventing feedback noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of tunable laser packages is reduced, then the laser can be used in a greater number of applications and fit various form factors, but the available space for components is limited and performance or reliability may be compromised
Solution Approach 1:
The patent implements nesting by placing the tunable laser assembly inside a hermetically sealed housing that fits within standardized form factor dimensions. The laser chip, mounting substrate, and optical components are nested within the housing in a compact arrangement that maintains performance while achieving small package size (e.g., XFP, SFP, or XENPAK form factors).
Solution Approach 2:
The patent segments the laser system into distinct functional modules: a tunable laser assembly containing the laser chip and mounting substrate, and a hermetically sealed housing containing optical components. This segmentation allows each module to be optimized independently for size and performance, then integrated into a compact overall package that meets form factor requirements while maintaining reliability.
2Adaptability or versatility
If the package size is reduced to fit form factors, then interchangeability and application versatility improve, but component layout and optical path design become more challenging
Solution Approach 1:
The patent designs the hermetically sealed housing and mounting substrate to accommodate multiple form factor standards (XFP, SFP, XENPAK). The same basic laser assembly design can be adapted to different form factors by adjusting the housing dimensions and interface configurations, providing universal compatibility across multiple standardized packages without redesigning the core laser functionality.
Solution Approach 2:
The patent arranges optical components and the optical path in three-dimensional space within the compact housing. By utilizing vertical stacking and angled optical paths rather than linear horizontal arrangements, the design fits complex optical functionality into the limited volume of small form factor packages, transforming the layout problem from two-dimensional to three-dimensional space utilization.
3Ease of operation
If standard form factor dimensions are used, then interchangeability between manufacturers is enabled, but the internal space for optical components is constrained
Solution Approach 1:
The patent employs a hermetically sealed housing with thin-walled construction that maintains structural integrity and optical performance while maximizing internal volume. The housing design includes optimized wall thickness and structural reinforcement at critical points, allowing the use of standard form factor external dimensions while preserving maximum internal space for optical components and maintaining hermetic sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact tunable laser that fits various form factors, providing stable and reliable operation with adjustable wavelength emission, suitable for use in pluggable optical transceivers and other applications, while preventing feedback noise and ensuring stable locking and lasing.
Implementation Method 1
an optical isolator positioned in the interior space of the housing and in the path of the first beam downstream of the beam splitter to prevent the incoming light from the beam splitter from reflecting back though the beam splitter and into the cavity of the laser
Implementation Method 2
a photodiode in the interior space of the housing and disposed in the path of the second beam for determining the emitted intensity of the laser beam
Implementation Method 3
a focusing lens assembly positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface
Data Source
AI summary
A tunable laser configured in a small package coupled to a printed circuit board. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A beam splitter and photodiode is disposed in the path of the laser beam for determining the emitted intensity of the laser beam, and an optical isolator is positioned downstream of the beam splitter to prevent the incoming light from the beam splitter from reflecting back though the beam splitter and into the cavity of the laser.