Tunable Laser Packaging Structure with Vertical Thermal Sink
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for lasers at different wavelengths in optical fiber communication systems leads to a large number of laser devices at constant wavelengths, resulting in increased costs and complexity due to the need for multiple devices.
Innovation Solution
A tunable laser device packaging structure and method that includes a semiconductor laser chip, thermoelectric cooler, thermal sinks, aspheric lens, and Distributed Bragg Reflector, allowing for wavelength adjustment by changing the current injected into the DBR and temperature control, eliminating the need for a right-angled lens and reducing package size and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple laser devices at different constant wavelengths are provided to meet DWDM technology demands, then the wavelength diversity is improved, but the device quantity and cost increase
Solution Approach 1:
The patent implements a single laser device that can operate at multiple wavelengths by integrating a Distributed Bragg Reflector (DBR) into the semiconductor laser chip. The DBR allows the laser to be tuned across different wavelengths within a specific range, making one device perform the function of multiple wavelength-specific devices, thereby reducing the total number of devices required while maintaining wavelength diversity for DWDM applications
Solution Approach 2:
The patent introduces dynamic wavelength tuning capability by incorporating a DBR with adjustable reflectivity characteristics. By controlling the current injected into the DBR and adjusting the temperature through a thermoelectric cooler, the laser wavelength can be dynamically adjusted across a tuning range, enabling a single device to adapt to different wavelength requirements rather than being fixed at one wavelength
2Adaptability or versatility
If multiple laser devices at different constant wavelengths are provided, then the wavelength coverage is improved, but the system complexity increases
Solution Approach 1:
The patent consolidates multiple wavelength-specific functions into a single universal laser device equipped with a DBR. This single device can cover a broad wavelength range by tuning the DBR reflection band, eliminating the need for multiple separate laser devices and their associated mounting, alignment, and control systems, thereby significantly reducing system complexity while maintaining comprehensive wavelength coverage
Solution Approach 2:
The patent merges the functions of multiple constant-wavelength laser devices into one tunable laser device. By combining the semiconductor laser chip with a DBR structure and temperature control mechanism, the system achieves wavelength tuning capability in a single integrated package, reducing the complexity of managing multiple discrete devices
3Ease of operation
If a right-angled lens is used in the packaging structure, then the optical path is achieved, but the package size and manufacturing complexity increase
Solution Approach 1:
The patent removes the right-angled lens from the packaging structure entirely. Instead of using a separate right-angled lens to achieve the desired optical path, the invention integrates the necessary optical functionality directly into the semiconductor laser chip through the DBR structure, which can redirect the laser beam without requiring additional external optical components, thereby reducing package size and simplifying manufacturing
Solution Approach 2:
The patent combines the optical path control function with the laser generation function by integrating the DBR directly into the semiconductor laser chip. This merging eliminates the need for separate optical components like right-angled lenses, as the DBR itself performs both wavelength selection and optical direction control, reducing the overall package size and manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of a compact, cost-effective tunable laser device capable of generating a wide range of wavelengths, reducing the number of devices required and improving manufacturing efficiency while maintaining high thermal conductivity and precise temperature control.
Implementation Method 1
a thermoelectric cooler disposed on the TO tube base
Implementation Method 2
a Distributed Bragg Reflector disposed in the semiconductor laser chip
Implementation Method 3
an aspheric lens disposed on the TO tube cap
Implementation Method 4
adhering the thermoelectric cooler on the TO tube base through eutectic soldering or high thermal conductivity glue
Implementation Method 5
soldering the TO tube cap soldered with the aspheric lens on the TO tube base through resistance welding
Implementation Method 6
adhering the first thermal sink on the thermoelectric cooler through eutectic soldering or high thermal conductivity glue
Data Source
AI summary
The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.