Tunable Light Projector Compactness via Vertical Substrate Connections
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Solution Overview
Problem
Conventional tunable light projectors in mobile devices face challenges in reducing the overall area of the light control element due to the misalignment or offset of substrates for electrical connections, which complicates the bonding process and increases the device's size.
Innovation Solution
A tunable light projector design featuring a light control element with a first and second substrate, electrodes, liquid crystal layers, and internal conductive objects, where through holes and intermediate conductive objects are strategically placed to enable electrical connections without the need for a large bonding area, allowing for a more compact structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are misaligned or offset to expose bonding area for electrical connection, then electrical connectivity is achieved, but the overall area of the light control element increases
Solution Approach 1:
The patent transitions from planar bonding to three-dimensional vertical connections by forming conductive objects that extend through the substrate thickness direction. This allows electrical connections to be made in the vertical dimension rather than requiring lateral offset bonding areas, thereby reducing the overall device area while maintaining connectivity.
Solution Approach 2:
The substrate is designed with through-holes that penetrate through its thickness, creating a porous structure that accommodates conductive objects. These through-holes enable vertical electrical pathways through the substrate without requiring lateral bonding areas, thus resolving the contradiction between connectivity and area reduction.
2Area of stationary object
If through holes are formed in substrate to reduce bonding area, then device compactness is improved, but manufacturing complexity increases
Solution Approach 1:
The through-holes are formed in the substrate before the conductive objects are deposited or inserted into them. This preliminary formation of the hole structure simplifies the overall manufacturing process by establishing the vertical pathways early, allowing subsequent steps to focus on filling or inserting the conductive elements rather than creating complex aligned structures.
Solution Approach 2:
The manufacturing process is divided into distinct stages: first forming the through-holes in the substrate, then separately preparing and inserting or depositing the conductive objects into these holes. This segmentation of the manufacturing process makes each step more manageable and reduces overall complexity compared to attempting to create the complete vertical connection structure in a single complex operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall area of the light control element, enhancing the compactness and efficiency of the tunable light projector while maintaining effective electrical connectivity, thereby improving the device's performance and usability.
Implementation Method 1
a first liquid crystal layer 130, a second electrode 140 sequentially arranged along a direction Z
Implementation Method 2
The first electrode 120 and the second electrode 140 can be selectively transparent or non-transparent to the light beam L
Data Source
AI summary
A light control element includes a first substrate, a first electrode, a first liquid crystal layer, a second electrode, a second substrate, a first internal conductive object, a first intermediate conductive object and a second internal conductive object. A peripheral area of the second substrate has a first through hole. The first internal conductive object is disposed in a first through hole of the second substrate. The first intermediate conductive object is disposed between the peripheral area of the second substrate and the first substrate, and is electrically connected to the first electrode and the first internal conductive object. The peripheral area of the second substrate further has a second through hole. The second internal conductive object is disposed in the second through hole of the second substrate and is electrically connected to the second electrode.