Tunable Microstrip Signal Transmission Path in Hard Disk Drive

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Solution Overview

Problem

Current compensation networks in hard disk drives, which often include capacitors or inductors, are impractical due to their size and cost, making it difficult to achieve optimal signal transfer in the limited space of the hard disk drive layout.

Innovation Solution

The implementation of tunable microstrip transmission paths, where non-terminated signal pathways are used to achieve a desired impedance level, reducing impedance and improving signal transfer by optimizing the layout and using conductive substrate islands for further impedance reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional compensation networks with capacitors or inductors are used, then signal transfer can be optimized, but the device complexity and physical space requirements increase significantly

Engineering Contradiction:
Improvesignal transferVSAvoidcompensation network
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the compensation function from separate discrete components (capacitors and inductors) and integrates it directly into the transmission line structure itself. The microstrip transmission line is designed with specific geometric parameters (width, spacing, substrate properties) that provide the necessary impedance transformation and signal compensation internally, eliminating the need for external compensation network components.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The microstrip transmission line structure performs multiple functions simultaneously: it serves as both the signal transmission pathway and the impedance compensation mechanism. By carefully designing the microstrip geometry (conductor width, substrate thickness, dielectric constant), the same structure that transmits the signal also provides the necessary impedance matching and signal integrity optimization, combining what were previously separate functions into one universal element.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If capacitive or inductive compensation components are added, then signal transfer improves, but the area occupied in the physical layout increases

Engineering Contradiction:
Improvesignal transferVSAvoidlayout area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the compensation function with the transmission line structure by designing the microstrip geometry itself to provide impedance compensation. The conductor trace width, spacing from reference planes, and substrate properties are engineered to create the desired impedance characteristics, combining signal transmission and impedance control into a single integrated structure that occupies minimal space.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent achieves impedance compensation by changing the geometric parameters of the microstrip transmission line. By adjusting conductor width, trace spacing, substrate thickness, and dielectric constant, the characteristic impedance of the transmission line is optimized to provide signal compensation without adding discrete components. This parameter-based approach allows precise control of electrical characteristics within the available physical space.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively lowers signal impedance within the gimbal area, enhancing signal transfer efficiency while minimizing the physical space required, thus overcoming the limitations of conventional compensation networks.

Implementation Method 1

A first suspension electrical interconnect is configured to electrically couple a first signal conducting pathway with the slider and with a first non-terminated signal pathway. A second suspension electrical interconnect is configured to electrically couple a second signal conducting pathway with the slider and with a second non-terminated signal pathway.

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

The length of the second non-terminated signal pathway is selected to achieve a desired impedance level

Methodology Applied
Scientific EffectImpedance matching: Electrical Impedance Tomography

Data Source

PatentUS8305712B2Tunable microstrip signal transmission path in a hard disk drive
Publication Date: 2012.11.06 WESTERN DIGITAL TECHNOLOGIES INC
  • US8305712B2 patent drawing
  • US8305712B2 patent drawing
  • US8305712B2 patent drawing

AI summary

A disk pack, comprising at least one hard disk, is rotatably mounted to a housing. The disk pack defines an axis of rotation and a radial direction relative to the axis. At least one actuator mounted to the housing is coupled with a suspension and is movable relative to the disk pack. A slider, comprising a slider body and a head configured to read data from and write data to at least one hard disk, is coupled with the suspension. A first suspension electrical interconnect is configured to electrically couple a first signal conducting pathway with the slider and with a first non-terminated signal pathway. A second suspension electrical interconnect is configured to electrically couple a second signal conducting pathway with the slider and with a second non-terminated signal pathway. The length of the second non-terminated signal pathway is selected to achieve a desired impedance level.