Tunable RF Filter Structure for Multi-Band Flexibility

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Solution Overview

Problem

Existing RF communications systems face challenges in achieving flexibility, efficiency, and cost-effectiveness due to the need for complex switching and duplexing components to support multiple communications protocols and bands, which often result in increased size, power consumption, and non-linearity.

Innovation Solution

The implementation of a tunable RF filter structure with weakly coupled resonators and cross-coupling capacitive structures that form a matrix configuration, allowing for independent tuning of filter paths without significant loading at frequencies of interest, thereby eliminating the need for front-end switching elements and simplifying the architecture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If complex switching and duplexing components are used to support multiple communications protocols and bands, then flexibility and adaptability are improved, but device size, power consumption, and non-linearity increase

Engineering Contradiction:
ImproveflexibilityVSAvoiddevice size
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements dynamically tunable resonators that can be adjusted to support multiple communications bands and protocols. The resonators' resonant frequencies can be changed on-demand to match different band requirements, eliminating the need for fixed, dedicated hardware for each band. This dynamic adjustment capability provides flexibility while maintaining a compact device structure.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent creates a universal filter structure where a single set of resonators can serve multiple communications bands through tuning mechanisms. Rather than having separate fixed filters for each band, the same resonant structure can be configured to operate across different frequency ranges, reducing the overall number of components needed and decreasing device size.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If complex switching and duplexing components are used to support multiple communications protocols and bands, then flexibility and adaptability are improved, but power consumption increases

Engineering Contradiction:
ImproveflexibilityVSAvoidpower consumption
Core Design Contradiction:
Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The dynamically tunable resonators allow the system to switch between bands by adjusting resonant frequencies rather than physically switching between separate filter components. This reduces the power required for band switching and eliminates the continuous power consumption associated with maintaining multiple active filter paths simultaneously.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent extracts and eliminates the need for front-end switching elements and duplexing components by using a unified tunable resonator structure. This removal of unnecessary components directly reduces power consumption while maintaining the ability to support multiple bands through frequency tuning.

Inventive Principle:
Principle #2Taking out (Extraction)

3Adaptability or versatility

If complex switching and duplexing components are used to support multiple communications protocols and bands, then flexibility and adaptability are improved, but non-linearity increases

Engineering Contradiction:
ImproveflexibilityVSAvoidnon-linearity
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes switching and duplexing components from the signal path, which are sources of non-linearity. By using a direct tunable resonator approach without intermediate switching elements, the system maintains better linearity while still achieving flexibility through frequency tuning of the resonators.

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of manufacture

If traditional interconnection paths are used to connect inductor terminal and device contact, then ease of manufacture is improved, but quality factor degrades due to current crowding

Engineering Contradiction:
Improveease of manufactureVSAvoidquality factor
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent transitions the interconnection path from a planar two-dimensional layout to a three-dimensional vertical structure. The interconnection path extends vertically through multiple metal layers, allowing current to flow in the vertical dimension rather than being constrained to horizontal planes. This dimensional change distributes current more effectively and prevents current crowding at corners, maintaining high quality factor while remaining compatible with standard semiconductor manufacturing processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the flexibility and efficiency of RF communications systems by reducing size, cost, and non-linearity while enabling support for multiple communications bands with improved quality factors and reduced interference between filter paths.

Implementation Method 1

a MIM capacitive structure 410 including a first plate 412, a second plate 414, and a dielectric material 416

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

an inductor having an inductor terminal

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS9893710B2High quality factor interconnect for RF circuits
Publication Date: 2018.02.13 QORVO US INC
  • US9893710B2 patent drawing
  • US9893710B2 patent drawing
  • US9893710B2 patent drawing

AI summary

Embodiments of radio frequency (RF) devices are disclosed having interconnection paths with capacitive structures having improved quality (Q) factors. In one embodiment, an RF device includes an inductor having an inductor terminal and a semiconductor die. The semiconductor die includes one or more active semiconductor devices that include a device contact. The device contact provided by the one or more active semiconductor devices is positioned so as to be vertically aligned directly below the inductor terminal. The inductor terminal and the device contact are electrically connected with an interconnection path that includes a capacitive structure. To prevent or reduce current crowding, the interconnection path is vertically aligned so as to extend directly between the inductor terminal and the device contact. In this manner, the interconnection path electrically connects the inductor terminal and the device contact without degrading the Q factor of the RF device.