Tunable Two-Phase Liquid Cooling for CPU Junction Temperature
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Solution Overview
Problem
Legacy cooling solutions face challenges in managing the increasing heat flux from miniaturizing CPU dies with higher thermal design power, particularly in maintaining low junction die temperatures and efficiently dissipating heat in high-power dense computing systems.
Innovation Solution
A tunable pumped two-phase liquid cooling thermal management system that incorporates a thermoelectric module (TEM) to sub-cool the coolant before it reaches the CPU cold plate and increase vapor content in the coolant mixture, enhancing heat transfer efficiency and reducing junction temperatures through a combination of liquid-enhanced air cooling (LEAC) and pumped liquid multiphase cooling (PLMC) technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If legacy air cooled or single-phase liquid cooling solutions are used, then the system structure is simple, but the CPU junction die temperature cannot be sufficiently lowered for high power dense components
Solution Approach 1:
The patent employs two-phase liquid cooling where the coolant transitions between liquid and vapor phases to efficiently remove heat from high power dense CPU components. The coolant absorbs heat during evaporation and releases it during condensation, enabling superior heat transfer compared to single-phase systems while managing the complexity through controlled phase change mechanisms
Solution Approach 2:
The cooling system is divided into multiple cold plates connected in series, with each cold plate handling specific thermal zones. This segmentation allows optimized thermal management for different CPU regions and enables the system to scale with component complexity while maintaining effective cooling through distributed heat extraction points
2Adaptability or versatility
If multiple cold plates are connected in series to cool multiple components, then more components can be cooled, but the second cold plate becomes hotter than the first
Solution Approach 1:
The patent implements dynamic flow distribution across the series-connected cold plates using flow control mechanisms that adjust coolant allocation based on real-time thermal conditions. This dynamic adjustment ensures each cold plate receives appropriate flow rates to maintain uniform temperature distribution across all components, preventing downstream plates from becoming excessively hot
Solution Approach 2:
The system varies coolant flow parameters and temperature settings for each individual cold plate in the series connection. By independently controlling flow rates, inlet temperatures, and residence times for each cooling zone, the system optimizes thermal performance across all components while adapting to their specific thermal requirements
3Temperature
If inlet air temperature increases or workload increases, then cooling demand increases, but legacy systems cannot sufficiently lower CPU temperature
Solution Approach 1:
The patent incorporates temperature sensors and control systems that continuously monitor CPU junction die temperature and coolant conditions. This feedback mechanism dynamically adjusts coolant flow rates, pump speeds, and cold plate configurations to maintain target temperatures under varying workloads and ambient conditions, enabling the system to adapt to changing thermal demands in real-time
Solution Approach 2:
The cooling system employs dynamic control mechanisms that adjust operational parameters based on real-time thermal conditions. Pump speeds, flow distribution, and cold plate configurations are continuously optimized to maintain effective cooling across the full range of workload scenarios and ambient temperature variations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively lowers CPU junction and case temperatures, reduces energy consumption, and maintains thermal performance across varying workload conditions, including turbo modes, while minimizing fan speeds and rotational vibration interference.
Implementation Method 1
a thermoelectric module (TEM) to sub-cool the coolant before it reaches the CPU cold plate
Implementation Method 2
the hot side is to warm the coolant in a second of the plurality of phases enroute from an outlet manifold of the cold plate
Implementation Method 3
A tunable pumped two-phase liquid cooling thermal management system utilizing a thermoelectric module (TEM) to sub-cool the coolant
Data Source
AI summary
Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.