Tuned Heatsink Layers for Data Media Thermal Gradient

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Solution Overview

Problem

Current data storage devices face challenges in achieving high thermal gradients for improved data transfer rates without disrupting the crystallographic orientation of magnetic recording layers, leading to issues like media jitter and increased laser power requirements.

Innovation Solution

The use of contactingly adjacent heatsink layers with tuned crystallographic orientation and varying thermal conductivities to create a predetermined thermal gradient, eliminating the need for a thermal resistor layer and maintaining crystallographic orientation throughout the data media.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a thermal barrier layer is introduced to increase thermal gradient, then thermal gradient is improved, but minimum laser power increases and crystallographic orientation is disrupted

Engineering Contradiction:
Improvethermal gradientVSAvoidminimum laser power
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent applies local quality by creating distinct thermal conductivity zones within the heatsink layers. By varying the thermal conductivity of individual layers (with at least one layer having thermal conductivity between 1-10 W/mK and another layer having thermal conductivity between 10-100 W/mK), the structure achieves localized thermal management that optimizes both thermal gradient and laser power efficiency without requiring a thermal barrier layer.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining multiple heatsink layers with different thermal conductivities and crystallographic orientations. This composite structure (comprising layers such as Ru, Rh, Ir, Os, Pt, Pd, Cu, Ag, Au, Al, Co, and their alloys) enables simultaneous optimization of thermal gradient, crystallographic orientation continuity, and laser power requirements that cannot be achieved with a single material.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If high thermal conductivity heatsink materials are used, then heat dissipation is improved, but media jitter increases

Engineering Contradiction:
Improveheat dissipationVSAvoidmedia jitter
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent applies local quality by creating distinct thermal conductivity zones within the heatsink layers. By varying the thermal conductivity of individual layers (with at least one layer having thermal conductivity between 1-10 W/mK and another layer having thermal conductivity between 10-100 W/mK), the structure achieves localized thermal management that optimizes both thermal gradient and laser power efficiency without requiring a thermal barrier layer.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining multiple heatsink layers with different thermal conductivities and crystallographic orientations. This composite structure (comprising layers such as Ru, Rh, Ir, Os, Pt, Pd, Cu, Ag, Au, Al, Co, and their alloys) enables simultaneous optimization of thermal gradient, crystallographic orientation continuity, and laser power requirements that cannot be achieved with a single material.

Inventive Principle:
Principle #40Composite materials

3Temperature

If thermal barrier layer is introduced to increase thermal gradient, then thermal gradient is improved, but crystallographic orientation is disrupted

Engineering Contradiction:
Improvethermal gradientVSAvoidcrystallographic orientation
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent employs composite materials by combining multiple heatsink layers with different thermal conductivities and crystallographic orientations. This composite structure (comprising layers such as Ru, Rh, Ir, Os, Pt, Pd, Cu, Ag, Au, Al, Co, and their alloys) enables simultaneous optimization of thermal gradient, crystallographic orientation continuity, and laser power requirements that cannot be achieved with a single material.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies parameter changes by systematically varying the thermal conductivity and thickness of individual heatsink layers. By adjusting these parameters (with thermal conductivity ranging from 1-100 W/mK across different layers and optimized thickness ratios), the structure achieves the desired thermal gradient while maintaining continuous crystallographic orientation through the layered structure.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for increased data capacity and transfer rates with reduced media jitter and lower laser power requirements, enabling smaller and more densely packed data bits while maintaining accurate data access operations.

Implementation Method 1

first and second heatsink contactingly adjacent layers can be tuned with a common crystallographic orientation and with different thermal conductivities to provide a predetermined thermal gradient

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8765273B1Tuned heatsink layers
Publication Date: 2014.07.01 SEAGATE TECH LLC
  • US8765273B1 patent drawing
  • US8765273B1 patent drawing
  • US8765273B1 patent drawing

AI summary

A data media may generally be configured in accordance with various embodiments with contactingly adjacent first and second heatsink layers that are tuned with a common crystallographic orientation and with different thermal conductivities to provide a predetermined thermal gradient. The data media may further be configured with a recording layer formed with the common crystallographic orientation adjacent the first and second heatsink layers.