Tungsten Probe Needle Material Adhesion Resistance
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Solution Overview
Problem
Probe needles used in semiconductor wafer tests experience electrode material adhesion and oxidation, leading to increased contact resistance and the need for frequent replacement, as the tungsten-based needles are prone to abrasion and fail to maintain stable contact over time.
Innovation Solution
A probe needle material comprising 0.1% to 3.5% by volume of hard-to-adhere compounds such as titanium boride, zirconium boride, or chromium oxide dispersed in a tungsten alloy matrix, which reduces electrode material adhesion and oxidation, enhancing contact stability and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a tungsten base material probe needle is used, then high strength and high hardness are achieved, but electrode material adhesion and oxidation occur leading to increased contact resistance
Solution Approach 1:
The patent applies composite materials by combining tungsten base material with specific compounds (borides, carbides, or oxides of titanium, zirconium, hafnium, niobium, tantalum, or chromium) to create a probe needle that maintains the strength and hardness of tungsten while adding adhesion resistance properties. The composite structure allows the probe needle to resist electrode material adhesion and oxidation, solving the reliability issue without sacrificing mechanical properties.
Solution Approach 2:
The patent changes the chemical composition parameters of the probe needle material by controlling the content of specific compounds (0.1-10 at% borides, 0.1-5 at% carbides, or 0.1-5 at% oxides). By adjusting these compositional parameters, the material achieves optimal balance between mechanical strength and adhesion resistance, preventing electrode material from adhering and oxidizing while maintaining the required strength and hardness.
2Productivity
If the probe needle is repeatedly contacted to electrodes, then wafer test is performed, but electrode material adheres to the tip and becomes impossible to perform normal wafer test
Solution Approach 1:
The patent applies preliminary anti-action by incorporating adhesion-resistant compounds (borides, carbides, or oxides) into the probe needle material before use. These compounds create a surface that resists electrode material adhesion from the outset, preventing the adhesion and oxidation problems that would otherwise occur during repeated wafer testing. This preliminary protection maintains low contact resistance throughout the testing process.
Solution Approach 2:
The composite material structure with tungsten base and adhesion-resistant compounds enables the probe needle to maintain its electrical conductivity and mechanical properties while resisting electrode material adhesion during repeated contacts, ensuring continuous wafer test capability with stable contact resistance.
3Reliability
If a tungsten alloy containing Y, La, or Ce is used, then electrode material adhesion is reduced, but the method does not necessarily maintain good contact for a long period and tip abrasion occurs
Solution Approach 1:
The patent changes the material composition parameters by selecting specific compounds (borides, carbides, or oxides of particular metals) and controlling their content ranges (0.1-10 at% for borides, 0.1-5 at% for carbides and oxides). This precise parameter control creates a material that simultaneously achieves long-term contact stability and resistance to tip abrasion during polishing, overcoming the limitations of previously used Y, La, or Ce-containing alloys.
Solution Approach 2:
The patent uses composite materials with tungsten base combined with specific adhesion-resistant compounds that provide both contact stability and abrasion resistance. The composite structure ensures that the probe needle maintains good contact for extended periods and withstands polishing processes without excessive tip wear, extending service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses electrode material adhesion and oxidation, maintaining stable contact for a longer period and reducing abrasion during polishing, thereby extending the lifespan of probe needles and improving the reliability of semiconductor wafer tests.
Implementation Method 1
hard-to-adhere compounds such as titanium boride, zirconium boride, or chromium oxide dispersed in a tungsten alloy matrix, which reduces electrode material adhesion
Implementation Method 2
reduces electrode material adhesion and oxidation, enhancing contact stability and durability
Implementation Method 3
a tungsten alloy mainly consisting of tungsten
Data Source
AI summary
Disclosed is a probe needle material used for producing a probe needle which is used in contact with an inspection object to inspect electrical characteristics of the inspection object, comprising not less than 0.1% by volume but not more than 3.5% by volume of at least one compound selected from the group consisting of titanium boride, zirconium boride, hafnium boride, niobium boride, tantalum boride, chromium boride, titanium carbide, zirconium carbide, hafnium carbide, vanadium carbide, niobium carbide, tantalum carbide, zirconium oxide, hafnium oxide and chromium oxide and the balance of a tungsten alloy mainly consisting of tungsten.