Turbulent Liquid Cooling for High-Density LED Assemblies
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Solution Overview
Problem
Conventional cooling techniques, such as air-cooling with heat sinks and fans, are insufficient for high-intensity LED lighting systems, which generate significant heat due to their high power density, limiting the packing density of LEDs and potentially causing thermal deterioration.
Innovation Solution
A cooling system that utilizes a fluid with turbulent flow to absorb heat from the LED assembly, a heat exchanger to exchange heat with the fluid, and a pump to circulate the fluid, enhancing heat dissipation and maintaining the LEDs within a safe temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional air-cooling techniques with heat sinks and fans are used, then the cooling system is simple to implement, but the heat dissipation capacity is insufficient for high-power LED assemblies
Solution Approach 1:
The patent transitions from air-cooling to liquid-cooling by circulating coolant through channels in direct contact with the LED assembly. The coolant absorbs heat more efficiently, enabling reliable cooling of high-power LED assemblies that generate excessive heat for conventional air-cooling methods.
Solution Approach 2:
The patent changes the cooling medium from gas (air) to liquid (coolant), fundamentally altering the heat transfer parameters. Liquid coolant provides superior thermal conductivity and heat capacity, enabling the system to dissipate the high heat loads generated by dense LED arrays while maintaining manageable system complexity.
2Illumination intensity
If LED packing density is increased to achieve higher light intensity, then the illumination output increases, but the heat generation exceeds cooling capacity and causes thermal deterioration
Solution Approach 1:
By implementing liquid cooling with coolant channels in direct thermal contact with the LED assembly, the system can dissipate the increased heat loads generated by high-density LED packing. This enables higher illumination intensity without thermal deterioration, as the liquid coolant efficiently removes heat from the junctions.
Solution Approach 2:
The coolant acts as an intermediary heat transfer medium between the LED assembly and the external environment. It absorbs heat directly at the source through thermal contact and transports it away, enabling the LED junctions to operate at high densities while maintaining safe operating temperatures through the mediating cooling fluid.
3Productivity
If high power density LED arrays are used, then the lighting efficiency increases, but conventional cooling methods cannot maintain LEDs below the critical temperature threshold
Solution Approach 1:
The patent employs liquid coolant circulation through channels in direct contact with the LED assembly to achieve reliable thermal management. This hydraulic cooling system provides sufficient heat dissipation capacity to maintain high power density operation while keeping LED temperatures below the critical 125°C threshold, ensuring long-term reliability.
Solution Approach 2:
The system changes from air-based to liquid-based cooling, fundamentally improving the heat transfer parameters. The liquid coolant's superior thermal properties enable the system to maintain high productivity through increased power density while ensuring thermal stability by effectively controlling junction temperatures within safe operating limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat dissipation in high-intensity LED lighting, allowing for higher power densities and longer operation times without thermal deterioration, enabling more compact and efficient lighting solutions.
Implementation Method 1
the fluid exhibits a turbulent flow at the LED assembly, the heat exchanger, or both, while circulated by the pump
Implementation Method 2
a fluid configured to absorb heat at the LED assembly
Implementation Method 3
a heat exchanger coupled to one or more substrates of the LED assembly, where the heat exchanger is configured to exchange heat between the LED assembly and the fluid
Data Source
AI summary
A cooling system for a light emitting diode (“LED”) assembly includes a fluid configured to absorb heat at the LED assembly, a heat exchanger coupled to one or more substrates of the LED assembly, where the heat exchanger is configured to exchange heat between the LED assembly and the fluid, and a pump configured to circulate the fluid along the LED assembly and the heat exchanger, where the fluid exhibits a turbulent flow at the LED assembly, the heat exchanger, or both, while circulated by the pump.