Turntable Probe Pin Gripper for Micrometer Bonding and Tight Pin Gaps
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Solution Overview
Problem
Conventional probe card manufacturing methods are not fully automated, leading to high defect rates and difficulty in precisely placing and bonding probe pins due to manual handling, which can damage the pins and limit the gap between them.
Innovation Solution
A turntable-type probe pin laser bonding apparatus with a multi-axis gripper unit that automatically laser-bonds probe pins to a probe card, featuring a pickup unit that rotates 360 degrees, a dipping unit for applying solder paste, and a laser bonding unit, with X-axis, Y-axis, Xθ-axis, and Yθ-axis transfer modules for precise linear and rotational movement of the pin gripper, utilizing piezoelectric actuators and encoders for precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual handling with pincette is used to transfer probe pins, then operational flexibility is maintained, but the probe pin is scratched or bent resulting in high defect rate
Solution Approach 1:
The patent replaces manual mechanical handling with pincette with an automated laser bonding apparatus that uses a suction unit to hold probe pins and a laser beam for bonding. This substitution eliminates human error and physical damage while maintaining precise control over the transfer and bonding process.
Solution Approach 2:
The apparatus enables self-service operation where the system automatically performs pickup, transfer, and bonding of probe pins without human intervention. The turntable automatically rotates to position grippers, the suction unit automatically holds and releases pins, and the laser bonding unit automatically bonds pins to the probe card.
2Productivity
If conventional manual transfer method is used, then equipment complexity is low, but production volume cannot be accurately predicted and varies by technical skill level
Solution Approach 1:
The patent incorporates feedback mechanisms through encoders that detect the rotational position of the turntable and provide feedback to the control unit. This ensures precise positioning of grippers and consistent operation, eliminating variability based on operator skill and enabling accurate prediction of production volume.
Solution Approach 2:
The turntable design allows multiple grippers to simultaneously perform pickup, transfer, and bonding operations in different positions. This multi-functional arrangement increases productivity and consistency while the modular design keeps the apparatus manageable in complexity.
3Manufacturing precision
If grip module with certain thickness is used to transfer probe pins, then structural stability is maintained, but the gap between probe pins cannot be narrowed below the thickness of the grip module
Solution Approach 1:
The patent divides the gripper system into multiple independent grippers mounted on different positions of the turntable, each capable of independent operation. This segmentation allows the use of thinner individual grip modules while maintaining overall structural stability through the distributed multi-axis configuration.
Solution Approach 2:
The patent introduces multi-axis movement capabilities (X-axis, Y-axis, Xθ-axis, Yθ-axis, and gripper axis) that allow the gripper unit to approach and position probe pins from multiple dimensions. This enables narrower gaps between pins by accessing positions that would be unavailable with a single thick grip module.
4Manufacturing precision
If fully automated laser bonding apparatus is implemented, then bonding precision and efficiency are improved, but the apparatus complexity and cost increase
Solution Approach 1:
The patent combines multiple functions (pickup, transfer, positioning, and laser bonding) into a single integrated turntable-type apparatus. By merging these functions into one cohesive system rather than separate devices, the patent achieves high bonding precision while managing overall apparatus complexity through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-precision, efficient, and automated pickup, dipping, and laser bonding of probe pins, minimizing physical damage and allowing for narrower gaps between pins, thereby improving the bonding process efficiency and precision.
Implementation Method 1
utilizing piezoelectric actuators and encoders for precise control
Implementation Method 2
a laser bonding unit bonds the probe pins to the probe card by irradiating a laser beam onto the solder paste of the probe pins
Data Source
AI summary
The present invention relates to a turntable-type probe pin laser bonding apparatus wherein a pin gripper mounted on four surfaces automatically laser-bonds a probe pin to a probe card while continuously rotating pin grippers in a turntable method. More particularly, the present invention relates to a multi-axis gripper unit of a turntable type probe pin laser bonding apparatus that can continuously process the pickup, dipping, and laser bonding of probe pins while freely moving linearly or rotationally in multi-axis directions, for example, the X-axis, Y-axis, Xθ-axis, Yθ-axis, and the gripper axis, with high precision in micrometer units by being applied to the laser bonding unit.