Turntable Substrate Handling for Microlithography Throughput
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Solution Overview
Problem
The transportation of substrates in nano-fabrication systems affects throughput due to inefficient loading and unloading processes, leading to increased handling times and potential defects.
Innovation Solution
A turntable system with adjustable positioning and actuator-controlled distance management between pedestals and substrate chucks, allowing for precise transfer and rotation to minimize contact and maintain substrate plane integrity, facilitating efficient loading and unloading while enabling inspection and patterning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If substrates are transported through multiple processing modules in nano-fabrication systems, then different aspects of multi-layered structures can be formed (etching, photoresist curing, feature formation), but substrate transportation affects system throughput and increases handling time
Solution Approach 1:
The patent combines multiple processing modules (etching, photoresist curing, feature formation) into a single integrated nano-fabrication system with a unified substrate handling mechanism. The turntable design allows substrates to be processed through all modules without external transportation, eliminating transport time while maintaining full processing versatility.
Solution Approach 2:
The turntable and substrate handling system are designed to be universal, accommodating multiple processing operations (etching, photoresist curing, feature formation) within a single device. The adjustable positioning mechanism and multiple pedestals enable the same substrate handling system to serve different processing functions without requiring separate transportation mechanisms for each module.
2Ease of operation
If traditional substrate loading and unloading processes are used, then substrates can be transferred between pedestals and processing modules, but handling time increases and potential defects occur due to excessive contact and contamination
Solution Approach 1:
The system pre-positions multiple pedestals around the turntable and maintains substrates in a ready state on these pedestals. The adjustable positioning mechanism is pre-configured to align with processing modules, allowing substrates to be transferred and processed immediately without additional setup or handling time.
Solution Approach 2:
The turntable acts as an intermediary device between pedestals and processing modules. Substrates are transferred to the turntable's opening ends, which then rotate to position substrates directly under processing modules. This intermediary mechanism minimizes direct contact between substrates and external handling tools, reducing contamination while maintaining ease of transfer.
3Productivity
If substrates are frequently loaded and unloaded from processing modules, then processing can continue, but contamination and defects increase due to repeated contact
Solution Approach 1:
The turntable and substrate handling system operate within a controlled environment that minimizes contamination. The enclosed design and minimized exposure during transfer operations create an inert-like environment that protects substrates from contaminants while allowing continuous processing. The reduced contact points and sealed pathways prevent external contaminants from reaching substrates during frequent load/unload operations.
Data Source
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AI summary
Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nanofabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.