Turret Handler Nozzle Indirect Push for Lead Integrity
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Solution Overview
Problem
Turret handlers face challenges in testing chips with leads, as the stress from the nozzle can deform the leads, reducing their strength and impacting the reliability of the tested chips, while maintaining high test efficiency with reduced volume.
Innovation Solution
A turret handler design that includes a nozzle, stage, test block, and abutting unit, where the nozzle indirectly pushes the element body, transmitting stress through the bottom rather than the leads, and an elastic structure to manage the test block's movement, maintaining lead integrity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the nozzle directly holds and moves the electronic element by the leads, then the testing process is simple and direct, but the leads are deformed by the stress and the standoff value decreases
Solution Approach 1:
The patent introduces a test block as an intermediary component between the nozzle and the electronic element. The test block includes a coupling unit that connects to the leads and a placement portion that receives the element body. This mediator allows the nozzle to apply stress to the element body without directly transmitting stress to the leads, thereby preventing lead deformation while maintaining the testing functionality.
Solution Approach 2:
The test block is divided into distinct functional segments: a coupling unit for connecting to the leads and a placement portion for receiving the element body. This segmentation allows different parts of the system to handle different aspects of the testing process, with the coupling unit managing lead connection and the placement portion managing element body positioning, thereby isolating the leads from direct stress.
2Productivity
If the nozzle continuously holds the electronic element during the testing process, then the picking and placing time is reduced and testing efficiency is increased, but the system complexity increases
Solution Approach 1:
The nozzle maintains continuous vacuum absorption on the element body throughout the entire testing process, from picking up the element to placing it back. This continuous holding action eliminates the need to repeatedly create and break vacuum, thereby reducing picking and placing time and increasing testing efficiency without requiring complex additional mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents lead deformation, maintains the standoff value, and increases the reliability of electronic elements by reducing stress on the leads and optimizing the testing process, enhancing efficiency by continuous vacuum absorption and reduced picking/placing time.
Implementation Method 1
the nozzle vacuum-absorbs and raises the electronic element from the element input unit
Data Source
AI summary
A turret handler is provided. The turret handler is adapted to test an electronic element. The electronic element includes an element body and a plurality of leads. The turret handler includes a nozzle, a stage, a test block, and an abutting unit. The nozzle is adapted to hold the element body to move the electronic element. The test block is disposed on the stage. The nozzle moves the electronic element to the test block. The test block includes a coupling unit and an initiative portion. The coupling unit includes a coupling portion, a pressing portion, and an elastic structure. The elastic structure is connected to the pressing portion. The initiative portion is connected to the elastic structure.