Twin Server Blade Side Rail Alignment for High-Density Cooling
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Solution Overview
Problem
Standard blade and cooling configurations in high-density clustered computer systems are inadequate in handling the scale and density requirements for high-performance computing, failing to provide sufficient flexibility in interconnect, power, and cooling.
Innovation Solution
A twin blade configuration with side rails for mounting computing boards, allowing for better positional control, flexibility in PCB thickness, and interleaving of components, combined with an on-blade cooling system and external cooling distribution unit for enhanced cooling capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standard blade configurations are used, then manufacturing simplicity is maintained, but processing density and cooling capacity are insufficient
Solution Approach 1:
The blade is divided into two separate computing boards (first and second computing boards) that can be independently configured and mounted on opposite sides of the blade chassis. This segmentation allows each board to be optimized for specific processing tasks while maintaining overall system density
Solution Approach 2:
The patent transitions from traditional single-board vertical mounting to a dual-board configuration where boards are mounted on opposite sides of the chassis, utilizing three-dimensional space more efficiently. This dimensional change enables higher processing density without increasing the blade's footprint
2Manufacturing precision
If computing boards are mounted with rigid fixtures, then alignment precision is improved, but flexibility in PCB thickness is reduced
Solution Approach 1:
The mounting system uses adjustable and removable fixtures that can accommodate different PCB thicknesses while maintaining precise alignment. The fixtures are designed to be dynamically adjustable rather than fixed, allowing the same mounting structure to work with various board configurations
Solution Approach 2:
The mounting fixtures are designed with universal adaptability to work with different PCB thicknesses and configurations. The same fixture design can accommodate various board types through adjustable mechanisms, eliminating the need for specialized fixtures for each board variant
3Productivity
If component density is increased, then processing power is improved, but heat generation increases requiring enhanced cooling
Solution Approach 1:
Heat-generating components are distributed across two separate computing boards mounted on opposite sides of the chassis. This spatial segmentation of heat sources allows for more effective heat dissipation by preventing heat concentration in a single location and enabling independent cooling strategies for each board
Solution Approach 2:
The patent introduces cooling intermediaries (cooling plates, heat sinks, or liquid cooling channels) positioned between the computing boards and the chassis walls. These intermediaries act as heat transfer mediators, conducting heat away from the dense components and transferring it to the cooling system
4Area of stationary object
If blade dimensions are reduced for high density, then space efficiency is improved, but weight and material usage decrease
Solution Approach 1:
The blade chassis utilizes thin-walled but structurally optimized enclosures that provide necessary mechanical support while minimizing material usage and weight. The chassis design employs flexible mounting structures that can accommodate the dual-board configuration without requiring heavy reinforcing elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces weight and material usage, enables better board alignment, and provides increased cooling capacity, supporting higher processing power while maintaining a compact design.
Implementation Method 1
The cooling plates may be disposed between the two computing boards in a side-by-side configuration, with one plate between the two computing boards in one region of the computing blade and the other plate between the two computing boards in another region of the computing blade
Implementation Method 2
The cooling manifold may include a supply line and a return line
Data Source
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AI summary
A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.