Twinaxial Cable Splitter for IC Die Package Testing
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Solution Overview
Problem
Conventional testing systems are not configured to test integrated circuit (IC) packages that include electrical cable connectors with twinaxial cables, specifically failing to receive and test the performance metrics of such IC packages.
Innovation Solution
A die package testing apparatus is designed to include a twinaxial cable splitter with electrically nonconductive substrate and first and second electrical conductors, allowing electrical communication between twinaxial cables and complementary electrical components, enabling the testing of IC packages with twinaxial cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional testing systems are used, then testing of standard IC packages is supported, but testing of IC packages with twinaxial cables is not possible
Solution Approach 1:
A twinaxial cable splitter is introduced as an intermediary device between the twinaxial cable and the conventional testing system. The splitter includes a housing with first and second coaxial cable connectors and a twinaxial cable connector, enabling the conventional testing system to interface with twinaxial cables through this mediating component without requiring system-wide redesign
2Adaptability or versatility
If twinaxial cable connectors are integrated into IC packages, then electrical communication capabilities are enhanced, but compatibility with conventional testing systems is lost
Solution Approach 1:
The testing interface is segmented into separate functional components: the twinaxial cable splitter handles the twinaxial connection interface, while the conventional testing system maintains its原有 architecture. This segmentation allows each component to be optimized for its specific function while maintaining overall system compatibility
Data Source
AI summary
A twinaxial cable splitter is in electrical communication with an IC die package. First and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package. Thus, a method is provided for testing an IC die package assembly by placing an IC package testing device in electrical communication with a first electrical connector mounted to a package substrate of the die package assembly that includes the package substate and an IC die mounted on the package substrate, and determining at least one performance metric of the die package assembly.