Twist-secured Power Semiconductor Module Mounting
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Solution Overview
Problem
Power semiconductor modules often become twisted relative to heat sinks during mounting, leading to uneven heat-conductive paste distribution and inadequate thermal contact, especially when using a single fastener or oversized threaded holes.
Innovation Solution
Incorporating a system with multiple positioning elements on both the power semiconductor module and heat sink, allowing for interfitting and secure alignment, combined with the use of fasteners to ensure twist-secured mounting and maintain thermal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single fastener is used to conjoin the power semiconductor module to the heat sink, then the device complexity is reduced, but the module may become twisted relative to the heat sink, smudging the heat-conductive paste
Solution Approach 1:
The positioning function is segmented from the fastening function. Multiple positioning elements (at least two) are provided to prevent twisting, while fasteners are used separately to conjoin the components. This segmentation allows alignment precision to be improved without requiring multiple fasteners.
Solution Approach 2:
Positioning elements are provided in advance on both the power semiconductor module and heat sink to pre-establish the correct alignment before fastening. This preliminary positioning action prevents twisting during the fastening process and ensures proper heat-conductive paste application.
2Ease of operation
If threaded holes are oversized to facilitate threading screws, then the ease of operation is improved, but the module may become twisted relative to the heat sink, smudging the heat-conductive paste
Solution Approach 1:
The positioning function is separated from the fastening function. Positioning elements provide precise alignment guidance, allowing threaded holes to be oversized for easy screw insertion without compromising alignment precision. The positioning elements constrain the module's position while screws are being threaded.
Solution Approach 2:
Positioning elements act as intermediary components between the power semiconductor module and heat sink. These elements facilitate easy assembly by guiding alignment while preventing twisting, allowing oversized threaded holes to be used without harming precision.
3Temperature
If heat-conductive paste is applied between the module and heat sink, then the heat dissipation is improved, but the module may become twisted during mounting, resulting in the paste becoming smudged
Solution Approach 1:
Positioning elements are provided in advance to establish correct alignment before heat-conductive paste is applied and before fastening occurs. This preliminary positioning ensures that the module cannot twist during mounting, protecting the paste application quality while maintaining effective heat dissipation.
Solution Approach 2:
The positioning elements provide beforehand protection against twisting that would smudge the heat-conductive paste. By constraining the relative position of the module and heat sink before paste application and fastening, the positioning elements cushion against the harmful twisting motion.
4Manufacturing precision
If multiple positioning elements are provided to prevent twisting, then the alignment precision is improved, but the device complexity increases
Solution Approach 1:
The positioning elements are designed to perform multiple functions: preventing twisting, guiding alignment, and facilitating assembly. This multi-functionality allows adequate alignment precision to be achieved with a minimal number of positioning elements (at least two), reducing the overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reliably secures the power semiconductor module to the heat sink, preventing twisting and ensuring a consistent, effective thermal interface without smudging the heat-conductive paste, thereby enhancing heat dissipation.
Implementation Method 1
Dissipating the heat of the power semiconductor module is then achieved by bringing the first thermal contact surface into contact with the second thermal contact surface
Data Source
AI summary
A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.