Twisted Wire Interconnection for Flexible Semiconductor Packages

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Solution Overview

Problem

In portable electronic systems, the flexibility of semiconductor devices poses challenges in maintaining electrical connections due to tensile or compressive stress, leading to separation or breakage of interconnection members, which affects the performance and reliability of semiconductor packages.

Innovation Solution

The semiconductor package module incorporates interconnection members with twisted and wound wires that extend in a predetermined direction, providing enhanced flexibility and stress relief by increasing the contact area and using protection members to prevent separation, ensuring stable electrical connections even when the package is bent or warped.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the substrate or semiconductor chip is made thin to allow bending, then flexibility is improved, but the interconnection members become susceptible to tensile or compressive stress causing separation or breakage

Engineering Contradiction:

ImproveflexibilityVSAvoidelectrical connection reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The interconnection member is configured with a curved shape including a first curved portion and a second curved portion. These curved portions allow the interconnection member to flex and absorb bending stresses without breaking, while maintaining electrical connection between the circuit substrate and semiconductor chip even when the substrate is warped or twisted

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The interconnection member changes its physical state from a straight rigid structure to a flexible curved structure. By configuring the wire in curved portions, the interconnection member can dynamically adjust its shape to accommodate bending and twisting of the thin substrate, absorbing external forces without separating from connection pads

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the interconnection member is made rigid to ensure stable electrical connection, then connection reliability is improved, but the semiconductor package cannot accommodate bending or twisting

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The interconnection member transitions from a static rigid structure to a dynamic flexible structure. The curved portions enable the interconnection member to dynamically adjust its shape in response to external forces, allowing the package to be bent or folded while maintaining reliable electrical connections

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS9699907B2Semiconductor package modules, memory cards including the same, and electronic systems including the same

Publication Date: 2017.07.04 MIMIRIP LLC

AI summary

A semiconductor package module may include a first substrate, and a second substrate disposed to face the first substrate. The semiconductor package module may include an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires. Portions of the plurality of wires may be twisted and wound together and may be bent to extend in a predetermined direction.