Two-Axis Specimen Polishing Holder for Uniform SEM Surfaces

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Solution Overview

Problem

Existing specimen polishing methods face challenges in uniformly polishing the observation surface of specimens due to shape distortions and errors during mounting, leading to issues like uneven wear and difficulty in accurately measuring critical dimensions using scanning electron microscopy.

Innovation Solution

A specimen polishing apparatus with a holder that allows for rotational freedom in two axes (x-axis and y-axis) to adjust the orientation of the specimen, ensuring equal pressure application and uniform polishing regardless of specimen shape or mounting errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the specimen is polished using conventional methods, then the polishing process can be completed, but the observation surface cannot be uniformly polished due to specimen shape distortion and mounting errors

Engineering Contradiction:
Improveuniformity of observation surfaceVSAvoidholder structure with rotational freedom
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The holder is designed with rotational freedom around the y-axis, allowing it to dynamically adjust its orientation angle. This dynamic capability enables the holder to adapt to specimens with different shapes and mounting errors, ensuring that the observation surface maintains uniform contact with the platen throughout the polishing process, thereby resolving the contradiction between polishing uniformity and device complexity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the orientation parameter of the holder by allowing rotation around the y-axis. By adjusting the orientation angle, the holder can compensate for specimen shape distortion and mounting errors, achieving uniform polishing of the observation surface without requiring complex additional components

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the specimen is cut using a laser, then the specimen can be manufactured quickly, but dust and heat affected zone exist on the cut surface making CD measurement difficult

Engineering Contradiction:
Improvespecimen manufacturing speedVSAvoidsurface quality for CD measurement
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The invention accepts the rapid laser cutting method that produces dust and HAZ, then uses the adjustable orientation holder to polish the observation surface. The polishing process removes the harmful dust and HAZ from the cut surface, converting the initially harmful rapid cutting method into a beneficial high-productivity approach by subsequently eliminating its negative effects through controlled polishing

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Manufacturing precision

If the specimen shape is distorted or mounting errors occur, then the polishing process becomes problematic, but uniform polishing of the observation surface is still required

Engineering Contradiction:
Improveuniformity of observation surfaceVSAvoidaccommodation of specimen variations
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The holder's rotational freedom around the y-axis provides dynamic adaptability to specimen variations. When specimen shape distortion or mounting errors occur, the holder can rotate to adjust its orientation angle, maintaining uniform contact between the observation surface and platen, thus achieving consistent polishing quality across different specimen conditions

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system responds to specimen variations by changing the orientation parameter of the holder through rotation. This parameter adjustment allows the system to accommodate different specimen shapes and mounting errors while maintaining the required uniformity of the observation surface during polishing

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250264384A1Specimen polishing apparatus
Publication Date: 2025.08.21 SAMSUNG ELECTRONICS CO LTD
  • US20250264384A1 patent drawing
  • US20250264384A1 patent drawing
  • US20250264384A1 patent drawing

AI summary

A specimen polishing apparatus configured to polish a specimen in contact with an upper surface of a platen includes a hanger in adjacent paced-apart relationship with an upper portion of the platen; a holder coupled to the hanger and configured to support the specimen so that an observation surface of the specimen faces the upper surface of the platen; and a driving portion coupled to the hanger and configured to move the hanger along a z-axis direction that is perpendicular to the upper surface of the platen. An orientation of the holder relative to the platen upper surface is adjusted through rotation around a y-axis direction that is parallel to a longitudinal direction of the observation surface of the specimen and rotation around an x-axis direction that is perpendicular to the z-axis and the y-axis.