Two-Layer Crimp Terminal Structure for Ultra-Fine Single Wires
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Solution Overview
Problem
Conventional crimp connection terminals struggle to reliably connect and fix ultra-fine metal wires made of a single copper alloy wire, due to insufficient flexibility and plasticity, leading to uneven caulking forces and mechanical/electrical reliability issues.
Innovation Solution
A conductor crimp structure using a connection terminal with a two-layer crimping piece structure, featuring void portions and pressing portions to concentrate strong forces at three locations, while non-pressing portions between the conductor and crimping pieces allow for reliable caulking and mechanical/electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional crimping piece is used to connect ultra-fine single-wire conductors, then the conductor can be fixed mechanically, but the caulking force is uneven and mechanical/electrical reliability is insufficient
Solution Approach 1:
The crimping piece incorporates pressing portions at specific locations that concentrate caulking force onto the conductor surface, creating localized high-pressure zones that ensure reliable mechanical fixation and electrical contact. This local quality approach transforms the uniform but weak caulking force into concentrated effective force at critical contact points.
Solution Approach 2:
The crimping piece is divided into multiple functional regions including pressing portions and non-pressing portions (void portions). This segmentation allows different areas to perform different functions: pressing portions provide concentrated mechanical fixation while void portions prevent excessive deformation and allow conductor flexibility to be maintained.
2Ease of manufacture
If a conductor made of a single ultra-fine wire is used, then cost is reduced, but the conductor lacks flexibility and plasticity making reliable crimping difficult
Solution Approach 1:
The invention changes the physical parameters of the crimping piece, specifically creating void portions (air gaps) between the crimping piece and conductor at certain locations. This parameter change allows the rigid crimping piece to accommodate the limited flexibility of single-wire conductors by providing space for the conductor to deform naturally without breaking, thus enabling reliable crimping of cost-effective ultra-fine single-wire conductors.
3Reliability
If oxides and sulfides on the conductor surface are present, then electrical disturbances occur, but removing them is extremely difficult with single-wire conductors
Solution Approach 1:
The pressing portions are designed to concentrate caulking force at specific locations where oxides and sulfides are most likely to interfere with electrical contact. By pre-positioning these pressing portions at optimal locations, the invention enables effective oxide removal through concentrated mechanical action during the crimping process itself, without requiring separate preprocessing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed crimp structure effectively caulks and fixes ultra-fine single-wire conductors, achieving reliable mechanical and electrical performance by concentrating forces and maintaining conductor flexibility.
Implementation Method 1
pressing portions for locally concentrating strong pressing forces on the conductor are provided at three locations
Implementation Method 2
a conductor with a small diameter made of twisted wires in which a plurality of core wires is twisted is fixed by a caulking force having adequate elasticity to keep the void portion without being excessively deformed
Data Source
Figure 1
Figure 2~3
Figure 4~6
AI summary
A conductor made of a single wire is crimped and fixed securely by a conductor crimping portion to achieve the reliability of electrical connection. In a conductor crimping portion, first and second crimping pieces each having a two-layer structure of an inner layer plate and an outer layer plate are raised in a U-shape in advance. Further, void portions are formed between the outer layer plate and the inner layer plate at folded portions of the crimping pieces. A conductor made of a single wire is disposed between the crimping pieces. The outer layer plate and the inner layer plate, particularly, the first and second crimping pieces are pressed by an upper press mold and a lower press mold of a conductor crimping apparatus to caulk and fix the conductor from all sides. In caulking the conductor, pressing forces in two directions, which are a pressing force from below toward the center of the conductor and a pressing force from obliquely upward toward the center of the conductor, are applied to form non-pressing portions between the inner layer plate and the conductor between pressing portions making contact with the conductor.