Two-Layer Polymer Housing for Heat Dissipation and Dimensional Stability
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Solution Overview
Problem
Existing housing parts for electronic devices face challenges in efficiently dissipating heat generated by components while maintaining high mechanical properties and dimensional stability, particularly in high-power applications.
Innovation Solution
A housing part composed of two layers, where the first layer is molded from a composition containing 50-90 wt.% of an amorphous polymer and 10-50 wt.% of a thermally conductive filler, with a thermal conductivity of 4-40 W/(m*K), and the second layer is molded over the first layer with a composition containing 50-90 wt.% of an amorphous polymer and 10-50 wt.% of a thermally conductive filler, with a thermal conductivity of 0.5-10 W/(m*K), leaving an area exposed to heat sources and incorporating heat sinks for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-layer housing with high thermal conductivity material is used, then heat dissipation efficiency is improved, but mechanical properties and dimensional stability deteriorate
Solution Approach 1:
The housing is divided into two distinct layers: a first layer with high thermal conductivity (4-40 W/(m*K)) for heat dissipation, and a second layer with lower thermal conductivity (0.5-10 W/(m*K)) for maintaining mechanical properties and dimensional stability. This segmentation allows each layer to perform its specialized function without compromising the other.
Solution Approach 2:
The housing uses a composite structure combining two different polymer compositions with contrasting thermal properties. The first composition contains thermally conductive fillers (10-50 wt.%) to achieve high thermal conductivity, while the second composition has lower thermal conductivity but superior mechanical properties. Together they form a composite housing that balances thermal management and structural requirements.
2Temperature
If high thermal conductivity filler content is increased, then thermal conductivity is improved, but mechanical properties deteriorate
Solution Approach 1:
Different regions of the housing have different material compositions optimized for their specific functions. The first layer contains high filler content (10-50 wt.%) for maximum thermal conductivity where heat dissipation is critical, while the second layer has appropriate mechanical properties for structural support. Each layer's composition is locally optimized rather than uniformly distributed.
3Strength
If the entire first layer is covered by the second layer, then mechanical properties are improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The second layer is deliberately not applied to specific areas of the first layer where heat sinks are located. This extraction of the second layer material from certain regions allows direct thermal contact between the high-conductivity first layer and the heat sinks, maximizing heat dissipation efficiency while maintaining the second layer's mechanical protection in other areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures high heat dissipating efficiency, good dimensional stability, and mechanical properties by leveraging the differential thermal conductivities of the layers, enhancing the housing's ability to manage heat and maintain structural integrity.
Implementation Method 1
the first composition having a thermal conductivity (TC1) of 4-40 W/ (m*K)... TC1 is at least 2 W/ (m*K) larger than TC2... the area of the first layer not being over-molded with the second layer comprises at least one heat sink for being coupled with at least a heat source
Implementation Method 2
the area of the first layer not being over-molded with the second layer comprises at least one heat sink for being coupled with at least a heat source
Data Source
Figure 1~2
Figure 3
AI summary
The present invention relates to a housing part, a housing and an electronic device. The housing part according to this invention comprises a first layer, said first layer being molded from a first composition comprising a1) 50-90 wt. % of a first amorphous polymer and b1) 10-50 wt. % of a first thermally conductive filler, the first composition having a thermal conductivity (TCI) of 4-40 W/ (m*K), a second layer, said second layer being molded from a second composition comprising a2) 50-90 wt. % of a second amorphous polymer and b2) 10-50 wt. % of a second thermally conductive filler, the second composition having a thermal conductivity (TC2) of 0.5-10 W/ (m*K), and the second layer being molded over the first layer by leaving at least one area of the first layer not being over-molded with the second layer for being exposed to at least one heat source, wherein, TC1 is at least 2 W/ (m*K) larger than TC2, the amounts of a1 and b1 are based on the total weight of the first composition, the amounts of a2 and b2 are based on the total weight of the second composition, and the thermal conductivity is measured in-plane according to ASTM El 461-01. The housing part provided in this invention has high heat dissipating efficiency and mechanical properties as well as high dimensional stability.