Two-Layer Power Line Structure for AMOLED Display Uniformity

The patent transitions from a single-layer power line structure to a multi-layer power line structure by adding vertical dimension through interlayer dielectric layers and via holes. This dimensional change allows current to flow through multiple parallel paths, reducing impedance and ohmic voltage drop while improving display uniformity across the panel.

The patent implements nested power line structures where multiple power lines are embedded within different metal layers and interconnected through via holes. The first power line in the first metal layer is nested with the second power line in the second metal layer, creating a hierarchical structure that reduces overall impedance while maintaining manageable complexity.

The patent segments the power line into multiple sections distributed across different metal layers. Each metal layer contains power lines that are electrically connected through via holes, creating a segmented structure that distributes current flow and reduces ohmic voltage drop across the entire power delivery network.

The patent creates a composite power line structure combining multiple metal layers with interlayer dielectric materials. This composite structure integrates conductive metal paths with insulating dielectric layers, enabling reduced impedance through parallel current paths while maintaining electrical isolation between layers.