Two-Material Fin Structure Balancing Cooling, Cost, and Weight
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Solution Overview
Problem
Conventional fin assemblies made of single materials face challenges in achieving high thermal conductivity, low cost, and light weight simultaneously, with aluminum assemblies being ineffective in cooling and copper assemblies increasing manufacturing costs and weight.
Innovation Solution
A fin structure composed of two assemblies made of different materials, where the inlet fin assembly has higher thermal conductivity than the outlet fin assembly, allowing rapid heat transfer and efficient cooling, while the outlet fin assembly is chosen for low cost and light weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the fin assembly is made of copper with higher thermal conductivity, then the electronic component can be effectively cooled, but the manufacturing cost and weight of the fin assembly increase
Solution Approach 1:
The fin assembly is divided into two segments: an inlet fin assembly and an outlet fin assembly. The inlet fin assembly uses copper with high thermal conductivity for effective heat transfer, while the outlet fin assembly uses aluminum with lower thermal conductivity to reduce weight and cost. This segmentation allows each part to be optimized for its specific functional requirements.
Solution Approach 2:
Different parts of the fin assembly are assigned different material properties according to their functional needs. The inlet fin assembly, which handles the primary heat transfer from the electronic component, uses copper for high thermal conductivity. The outlet fin assembly, which handles secondary cooling and has lower temperature requirements, uses aluminum for weight reduction and cost savings.
2Weight of stationary object
If the fin assembly is made of aluminum with low thermal conductivity, then the manufacturing cost and weight are reduced, but the electronic component cannot be effectively cooled
Solution Approach 1:
The fin assembly is segmented into two functional parts: the inlet fin assembly that requires high thermal conductivity for effective cooling, and the outlet fin assembly that can use lighter, cheaper material since it handles secondary cooling. This segmentation resolves the contradiction by matching material properties to functional requirements.
Solution Approach 2:
The inlet fin assembly is assigned copper material with high thermal conductivity to ensure effective heat transfer from the electronic component. The outlet fin assembly is assigned aluminum material with lower thermal conductivity to reduce weight and cost, as it operates at lower temperatures and handles less critical cooling.
3Temperature
If the fin assembly is made of copper with higher thermal conductivity, then the cooling efficiency is improved, but the manufacturing cost increases
Solution Approach 1:
The fin assembly is divided into two segments with different material compositions. The inlet fin assembly uses copper for high thermal conductivity and effective cooling. The outlet fin assembly uses aluminum for lower cost and weight. This segmentation allows the system to achieve high cooling efficiency where needed while reducing overall manufacturing cost.
Solution Approach 2:
Copper material is applied locally to the inlet fin assembly where high thermal conductivity is critical for heat transfer from the electronic component. Aluminum material is applied to the outlet fin assembly where cost reduction and weight savings are more important, as the thermal conductivity requirements are lower.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fin structure achieves high cooling efficiency, low cost, and light weight by utilizing materials with varying thermal conductivities, enhancing heat transfer and airflow cooling efficiency.
Implementation Method 1
a heat generated by a heat source may be transferred to the inlet fin assembly rapidly and effectively
Implementation Method 2
the cool air with relatively low temperature exchanges heat with the inlet fin assembly with higher temperature
Data Source
AI summary
A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.