Two-Phase Chip Cooling with Flexible Capillary Patterns
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Solution Overview
Problem
Existing cooling methods for semiconductor devices, such as immersion, spray, and jet impingement cooling, suffer from inefficiencies due to film boiling phenomena, requiring high management costs, environmental unfriendliness, and the need for complex pumping systems, which reduce cooling efficiency and are not suitable for high power density applications.
Innovation Solution
A two-phase liquid cooling system using capillary patterns with varying thermal expansion coefficients and curvature changes with temperature to stabilize coolant supply, preventing vapor adhesion and enhancing heat transfer by adjusting coolant flow based on temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion cooling is used, then cooling efficiency is improved, but film boiling phenomenon occurs reducing effectiveness
Solution Approach 1:
The patent employs a porous coating layer on the heat transfer surface that allows liquid coolant to penetrate and form capillary channels. This porous structure prevents film boiling by ensuring continuous liquid contact with the heating surface through capillary wicking action, eliminating the vapor film that causes film boiling phenomenon while maintaining high cooling efficiency
Solution Approach 2:
The patent applies a porous coating layer specifically on the heat transfer surface where film boiling occurs, rather than modifying the entire cooling system. This localized modification creates capillary channels exactly where needed to prevent vapor adhesion, resolving the film boiling issue without affecting other aspects of the cooling system
2Temperature
If spray cooling is used, then cooling efficiency is improved, but complex pumping systems are required
Solution Approach 1:
The patent replaces the mechanical pumping system with a passive capillary wicking mechanism. The porous coating layer creates capillary channels that automatically draw liquid coolant across the heat transfer surface through capillary pressure, eliminating the need for external pumps, valves, and complex flow control mechanisms while maintaining effective cooling
Solution Approach 2:
The cooling system becomes self-regulating through the capillary wicking mechanism. The porous structure automatically adjusts liquid flow based on local heat generation and temperature conditions, with no external control system needed. The capillary pressure self-adjusts to maintain optimal liquid supply without requiring pumps or control valves
3Temperature
If jet impingement cooling is used, then cooling efficiency is improved, but vapor adhesion reduces effectiveness
Solution Approach 1:
The porous coating layer creates a network of capillary channels that actively wick liquid coolant across the heat transfer surface. This continuous liquid supply through capillary action prevents vapor from adhering to the heating surface, directly addressing the vapor adhesion problem while maintaining high cooling efficiency through sustained liquid contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively supplies coolant to heat transfer surfaces, maintaining cooling efficiency by reducing vapor stagnation and adhesion, thus addressing inefficiencies in existing methods and supporting high power density applications.
Implementation Method 1
a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action
Implementation Method 2
Each capillary pattern of the plurality of flexible capillary patterns may include a first layer having a first thermal expansion coefficient and a second layer having a second thermal expansion coefficient that is different from the first thermal expansion coefficient
Data Source
AI summary
A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit; a cooling channel including a surface of the semiconductor chip and configured to provide a passage for a coolant to cool the semiconductor chip; and a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action, wherein each capillary pattern of the plurality of flexible capillary patterns may include a first portion in a length direction of the capillary pattern that contacts and is supported by the surface of the semiconductor chip, and a second portion in the length direction that is spaced apart from and unsupported by the surface of the semiconductor chip, and a curvature of the second portion of each capillary pattern of the plurality of flexible capillary patterns changes according to temperature.