Two-Phase Cooling Assembly for Densely Packed Data Processing Chips
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Solution Overview
Problem
Current endothermic phase change technologies are ineffective in dissipating heat from densely packed data processing chips, leading to inadequate cooling efficiency in data processing apparatuses.
Innovation Solution
A cooling device with a housing and heat dissipation assembly that includes a sealed space for cooling liquid, a heat dissipation assembly body, and a heat conducting pipe, where the cooling liquid transforms into gas to absorb heat and then converts back into liquid, enhancing heat dissipation through a circulation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If endothermic phase change technology is used to cool a single chip, then cooling efficiency is improved, but it is ineffective for dissipating heat from densely packed data processing chips
Solution Approach 1:
The cooling device is segmented into multiple functional components: a sealed space containing cooling liquid, a heat dissipation assembly with heat dissipation assembly body, and a heat conducting pipe. This segmentation allows each component to perform its specific function efficiently, with the cooling liquid absorbing heat from chips, the heat dissipation assembly body facilitating phase change, and the heat conducting pipe transferring heat outside the housing.
Solution Approach 2:
The heat dissipation assembly body is nested within the sealed space formed by the housing. The cooling liquid is contained within the sealed space, and the heat dissipation assembly body is positioned at 1/2 to 3/4 of the height direction within this space. This nested arrangement allows the heat dissipation assembly body to effectively utilize the cooling liquid's phase change while maintaining a compact structure suitable for densely packed chips.
2Use of energy by moving object
If cooling liquid transforms into gas to absorb heat, then heat absorption is enhanced, but the cooling liquid needs to be converted back into liquid for continuous circulation
Solution Approach 1:
The cooling liquid undergoes phase transition from liquid to gas in the first space by absorbing heat from the densely packed data processing chips. The gas then moves to the second space where it is converted back into liquid by the heat dissipation assembly body. This continuous phase change process enables efficient heat absorption and dissipation, while the sealed space design maintains the necessary pressure differential for automatic circulation without complex external pumping systems.
Solution Approach 2:
The cooling system operates autonomously through the phase change process. The cooling liquid automatically evaporates when it absorbs heat from the chips, and the resulting gas is automatically condensed by the heat dissipation assembly body. This self-service mechanism eliminates the need for external pumps or complex control systems, reducing device complexity while maintaining continuous circulation.
3Volume of stationary object
If the heat dissipation assembly body is positioned at 1/2 to 3/4 height, then space utilization is optimized, but the sealed space must be divided into two functional areas
Solution Approach 1:
The sealed space is divided into two regions with different functional qualities: the first space (lower region) accommodates the cooling liquid and to-be-cooled components where evaporation occurs, and the second space (upper region) maintains pressure and houses the heat dissipation assembly body where condensation occurs. This local differentiation of space quality allows each region to perform its specific function optimally while utilizing the vertical height of the housing effectively.
Solution Approach 2:
Instead of dividing the sealed space horizontally, the invention utilizes the vertical dimension by positioning the heat dissipation assembly body at 1/2 to 3/4 of the height direction. This vertical arrangement creates distinct upper and lower functional zones, effectively utilizing the height of the housing and enabling clear separation of evaporation and condensation regions without requiring complex horizontal partitions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves cooling efficiency by circulating and utilizing the cooling liquid to efficiently dissipate heat from densely packed data processing chips, maintaining high performance and reducing thermal issues.
Implementation Method 1
the cooling liquid transforms into a gas by absorbing heat of the to-be-cooled component
Implementation Method 2
absorb heat of the gas to convert the gas into the liquid
Data Source
AI summary
Embodiments of the present disclosure relate to a cooling device, including a housing and a heat dissipation assembly. A sealed space for accommodating cooling liquid is formed in the housing. The cooling liquid is in contact with a to-be-cooled component. The heat dissipation assembly includes a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body. The heat dissipation assembly body is arranged in the sealed space formed by the housing. The heat dissipation assembly body is configured to, after the cooling liquid transforms into the gas by absorbing the heat of the to-be-cooled component, absorb the heat of the gas to convert the gas into the liquid. The heat conducting pipe is at least partially located outside the housing. The heat dissipation assembly body is arranged at ½ to ¾ the position along the height direction in the housing.