Two-Phase Coolant Cooling for High-Heat Phased Arrays
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Solution Overview
Problem
Existing cooling systems for high-power phased array antenna systems, such as those using gallium nitride (GaN) MMICs, are inadequate for handling thermal densities beyond 100 Watts/in2, as they rely on single-phase coolants that cannot efficiently manage the increased heat dissipation of next-generation technologies.
Innovation Solution
A method and apparatus utilizing a two-phase coolant that directly contacts heat-generating circuit components or highly thermally conductive parts, allowing the coolant to absorb heat and change phases, thereby efficiently removing heat at higher rates, up to 1,000 Watts/in2, using a configuration that includes a cooling plate with orifices and a condensation system to recycle the coolant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-phase coolant is used for cooling, then the cooling system is simple to implement, but it cannot handle thermal densities beyond 100 Watts/in2
Solution Approach 1:
The patent applies phase transition by using a two-phase coolant system where the coolant transitions between liquid and vapor phases to absorb and remove heat. The coolant is introduced in liquid form, absorbs heat from the MMIC device causing partial vaporization, and the two-phase mixture is then condensed back to liquid in a heat exchanger, creating a continuous cooling cycle capable of handling high thermal densities up to 1000 Watts/in2
2Power
If next-generation MMIC technology with higher power consumption is adopted, then the performance and capability of the phased array system is improved, but the heat dissipation increases beyond the capacity of existing cooling systems
Solution Approach 1:
The patent changes the physical parameters of the cooling system by transitioning from a single-phase to a two-phase coolant system. This parameter change enables the cooling system to handle dramatically higher heat fluxes (up to 1000 Watts/in2) by utilizing the latent heat of vaporization, allowing next-generation high-power MMIC devices to operate without thermal limitations
3Temperature
If direct contact cooling is used to maximize heat transfer efficiency, then the cooling effectiveness is improved, but the risk of moisture ingress and corrosion increases
Solution Approach 1:
The patent employs an inert environment by using a hermetically sealed package that creates a controlled atmosphere around the MMIC device. The package fills with inert gas or vacuum to prevent moisture ingress and corrosion, while still allowing efficient thermal contact between the MMIC and the cooling system through thermally conductive packaging materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat removal at significantly higher rates than existing systems, minimizing temperature gradients and extending the operational lifetime of MMICs, while allowing for smaller and lighter phased array antenna systems with improved performance.
Implementation Method 1
The coolant absorbs heat generated by the circuit component
Implementation Method 2
at least part of the coolant changing from a first phase to a second phase in response to heat absorbed from the circuit component
Implementation Method 3
guiding a two-phase coolant along a path which brings the coolant into direct physical contact with the circuit component or with a highly thermally conductive part which is thermally coupled to the circuit component
Data Source
AI summary
An apparatus includes a circuit having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part which is thermally coupled to the circuit component. The coolant absorbs heat generated by the circuit component, at least part of the coolant changing from a first phase to a second phase in response to the heat absorbed from the circuit component, where the second phase is different from the first phase.