Two-Phase Cooling With Assisted Condensation for Semiconductor Heat Control
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Solution Overview
Problem
Semiconductor devices face challenges in thermal management due to heat dissipation issues, which can impact performance and require efficient cooling methods to maintain optimal operating conditions during testing and operation.
Innovation Solution
A fluid-based multi-phase cooling system with assisted condensation is employed, utilizing a thermal management system that includes heating and cooling units, fluid reservoirs, and condensation conduits to regulate temperature and pressure independently in thermal test chambers and semiconductor device systems, using fluids like water or hydrofluoroether to manage heat and vapor condensation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling or liquid cooling is used to dissipate heat from semiconductor devices, then heat dissipation is achieved, but thermal management effectiveness is insufficient for high-performance devices
Solution Approach 1:
The patent employs two-phase cooling where a working fluid undergoes phase transition from liquid to vapor in the evaporator section, absorbing latent heat from the semiconductor device. This phase change mechanism provides significantly higher heat dissipation capacity compared to single-phase liquid cooling, directly resolving the thermal management effectiveness issue for high-performance devices.
Solution Approach 2:
The system dynamically adjusts operating parameters including fluid flow rate, condensation temperature, and pressure conditions to optimize heat dissipation performance. By changing these parameters, the system adapts to different thermal loads and maintains optimal thermal management effectiveness across varying operating conditions.
2Device complexity
If conventional cooling systems are used, then simple structure is maintained, but independent control of temperature and pressure is not achieved
Solution Approach 1:
The cooling system is divided into functionally independent sections: an evaporator section for temperature control and a condenser section for pressure control. This segmentation allows each section to be optimized and controlled independently, enabling simultaneous independent adjustment of temperature and pressure parameters without requiring complex integrated control mechanisms.
Solution Approach 2:
The patent introduces a condensation section as an intermediary component between the evaporator and the environment. This intermediary enables decoupled control by providing a dedicated mechanism for pressure regulation through condensation control, while temperature is managed in the evaporator section, thus achieving independent control without proportionally increasing overall system complexity.
3Temperature
If vapor is generated in thermal test chambers, then heating function is achieved, but vapor pressure impacts the thermal test chamber and semiconductor device system
Solution Approach 1:
The patent converts the harmful vapor pressure into a beneficial mechanism by implementing a condensation section that deliberately condenses the vapor. The condensation process not only removes the harmful pressure buildup but also recovers latent heat, transforming the previously problematic vapor into a useful thermal management resource that enhances overall system efficiency.
Solution Approach 2:
The system utilizes controlled phase transition from vapor to liquid in the condensation section to manage vapor pressure. By facilitating this phase change, the system effectively removes excess vapor pressure from the thermal test chamber while simultaneously recovering thermal energy, thus eliminating the harmful effect while maintaining the beneficial heating function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively controls temperature and pressure variations, ensuring reliable performance of semiconductor devices by maintaining desired operating conditions and reducing the impact of vapor pressure on thermal test chambers and semiconductor device systems.
Implementation Method 1
a cooling unit that is capable of cooling a fluid
Implementation Method 2
In operation, the cooling unit can cool the fluid to a temperature that is less than the saturation temperature of the fluid at a system pressure
Implementation Method 3
Semiconductor chips are central to intelligent devices and systems... The operation of a semiconductor device can create heat which can be dissipated, for example, through air cooling or liquid cooling
Data Source
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AI summary
Systems for heat management of semiconductor systems are provided. The heat management systems can provide liquid cooling or heating for a plurality of semiconductor devices under test. The systems are also useful for liquid cooling of computing systems, such as datacenters.